C04B 2237/88
Joining of two substrates, where a substantial part of the joining material
Official title: Joining of two substrates, where a substantial part of the joining material is present outside of the joint, leading to an outside joining of the joint
C04B2237/88 (Joining of two substrates, where a substantial part of the joining material) appears on 70 US grants and 48 published applications in this corpus.
Search patents in C04B- Granted patents
- 70
- Published applications
- 48
- Assignees
- 50
- Inventors
- 147
- Latest grant
- 4 Mar 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 8 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 2 |
| 2009 | 2 | 1 |
| 2010 | 0 | 3 |
| 2011 | 0 | 3 |
| 2012 | 3 | 2 |
| 2013 | 2 | 1 |
| 2014 | 1 | 5 |
| 2015 | 3 | 4 |
| 2016 | 2 | 1 |
| 2017 | 0 | 1 |
| 2018 | 7 | 5 |
| 2019 | 1 | 1 |
| 2020 | 3 | 5 |
| 2021 | 2 | 2 |
| 2022 | 2 | 4 |
| 2023 | 1 | 2 |
| 2024 | 7 | 3 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Bonded assembly, and ceramic circuit substrate and semiconductor device using the same4 Mar 2025US 12,240,218 B2Kabushiki Kaisha Toshiba
- Method for manufacturing a ceramic copper circuit board10 Dec 2024US 12,167,534 B2Kabushiki Kaisha Toshiba
- Ceramic structural body19 Nov 2024US 12,145,891 B2KYOCERA Corporation
- Engine article with ceramic insert and method therefor6 Aug 2024US 12,055,045 B2Rtx Corporation
- Power module substrate and power module9 Jul 2024US 12,033,915 B2KYOCERA Corporation
- Ceramic copper circuit board and semiconductor device using same1 Aug 2024US 2024/0260182 A1Kabushiki Kaisha Toshiba
- Heat resistant structure and member for heat treatment furnace27 Jun 2024US 2024/0210114 A1Ohwada Carbon Industrial Co., Ltd.
- Engine article with ceramic insert and method therefor28 Mar 2024US 2024/0102400 A1Rtx Corporation
- Engine article with ceramic insert and method therefor7 Dec 2023US 2023/0392511 A1Raytheon Technologies Corporation
- Bonded Assembly, And Ceramic Circuit Substrate And Semiconductor Device Using The Same29 Jun 2023US 2023/0202137 A1Kabushiki Kaisha Toshiba
Most cited
By later US patents
- Methods for hermetically sealing ceramic to metallic surfaces and assemblies incorporating such seals130US 6,221,513 B1Pacific Coast Technologies, Inc. · 2001
- Interface connection through an insulating part40US 5,539,611 AEndress u. Hauser GmbH u. Co. · 1996
- Vacuum-tight metal-ceramic soldered joint35US 3,979,187 ABBC Brown, Boveri & Company, Limited · 1976
- Electronic component and its manufacturing method23US 7,557,307 B2Murata Manufacturing Co., Ltd. · 2009
- Method for making an interface connection through an insulating part22US 5,670,063 AEndress + Hauser GmbH + Co. KG · 1997