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US 12,033,915 B2Granted
Power module substrate and power module
AssigneeKYOCERA Corporation
InventorYoshitada Konishi
Life of this patent
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Abstract
A power module substrate 10 is provided with: an insulating substrate 1; and a metal sheet 2 that is joined to the insulating substrate 1 via a brazing material 3, wherein regarding the surface roughness, in the thickness direction, of the lateral surface of the metal sheet 2, the surface roughness of a corner 2a farthest from the center of the metal sheet 2 is larger than the surface roughness of plane parts 2b, which bound the corner, in at least a plan view. Also provided is a power module 100 which is formed by mounting an electronic component 40 on this power module substrate 10.
Claims5
A power module substrate comprising:
- an insulating substrate;
- and
- a plurality of metal plates joined to the insulating substrate with a brazing material in between and including:
- a first metal plate including a re-entrant corner part in plan view;
- wherein
- a lateral surface of the first metal plate includes the re-entrant corner part and plane parts sandwiching the re-entrant corner part, and
- a surface roughness of the lateral surface at the re-entrant corner part is smaller than the surface roughness of the lateral surface at the plane parts.
4 more elements
Dependencies are inferred from the claim text.