Electronic component and its manufacturing method

An electronic component comprising:

• a wiring board having a wiring pattern;
• surface mount devices mounted on a main surface of the wiring board;
• and
• a cover member arranged to cover the surface mount devices;
• wherein
• the cover member includes a top portion made of a flat ceramic member, and a leg portion made of a metal columnar member having a height that is substantially equal to heights of the surface mount devices;
• the top portion has a multilayered structure in which a plurality of ceramic layers are laminated;
• a shield electrode layer is disposed at at least one of an interlayer and an outer surface of the multilayered structure;
• and
• a via conductor is arranged to extend between and to electrically connect the metal columnar member and the shield electrode layer.