C04B 2237/72
Forming laminates or joined articles comprising at least two interlayers directly next
Official title: Forming laminates or joined articles comprising at least two interlayers directly next to each other
C04B2237/72 (Forming laminates or joined articles comprising at least two interlayers directly next) appears on 514 US grants and 360 published applications in this corpus.
Search patents in C04B- Granted patents
- 514
- Published applications
- 360
- Assignees
- 264
- Inventors
- 1,070
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 10 | 0 |
| 1986 | 11 | 0 |
| 1987 | 13 | 0 |
| 1988 | 11 | 0 |
| 1989 | 14 | 0 |
| 1990 | 12 | 0 |
| 1991 | 18 | 0 |
| 1992 | 17 | 0 |
| 1993 | 15 | 0 |
| 1994 | 12 | 0 |
| 1995 | 9 | 0 |
| 1996 | 12 | 0 |
| 1997 | 4 | 0 |
| 1998 | 10 | 0 |
| 1999 | 13 | 0 |
| 2000 | 17 | 0 |
| 2001 | 6 | 5 |
| 2002 | 17 | 19 |
| 2003 | 13 | 14 |
| 2004 | 12 | 18 |
| 2005 | 9 | 6 |
| 2006 | 7 | 6 |
| 2007 | 2 | 3 |
| 2008 | 2 | 8 |
| 2009 | 4 | 5 |
| 2010 | 9 | 19 |
| 2011 | 1 | 11 |
| 2012 | 8 | 31 |
| 2013 | 10 | 16 |
| 2014 | 14 | 18 |
| 2015 | 15 | 20 |
| 2016 | 15 | 32 |
| 2017 | 24 | 28 |
| 2018 | 15 | 15 |
| 2019 | 25 | 13 |
| 2020 | 18 | 13 |
| 2021 | 15 | 11 |
| 2022 | 11 | 12 |
| 2023 | 10 | 17 |
| 2024 | 13 | 8 |
| 2025 | 6 | 8 |
| 2026 | 8 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High temperature brazing of metals and ceramics to carbon substrates14 Jul 2026US 12,679,776 B2Honeywell International Inc.
- Compliant suture-based joinery21 Apr 2026US 12,606,495 B2Lawrence Livermore National Security, LLC
- Laminate for circuit board21 Apr 2026US 12,610,461 B2Tokuyama Corporation
- Absorbing structure17 Mar 2026US 12,577,684 B2Tusas- Turk Havacilik Ve Uzay Sanayii Anonim Sirketi
- Multi-layer ceramic plate device24 Feb 2026US 12,558,734 B2Watlow Electric Manufacturing Company
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
- Method for producing composite optical ceramic element11 Jun 2026US 2026/0158701 A1Hamamatsu Photonics K.K.
- Copper/ceramic bonded body and insulated circuit board27 Nov 2025US 2025/0365859 A1Mitsubishi Materials Corporation
Most cited
By later US patents
- Multilayer coated abrasive element for bonding to a backing162US 5,049,164 ANorton Company · 1991
- Methods for wafer to wafer bonding using microstructures110US 6,406,636 B1MegaSense, Inc. · 2002
- Brazing of diamond film to tungsten carbide105US 5,738,698 ASaint-Gobain/Norton Industrial Ceramics Corporation · 1998
- Methods of treating preform elements including polycrystalline diamond bonded to a substrate103US 6,056,911 ACamco International (UK) Limited · 2000
- Method of making reactive multilayer foil and resulting product95US 6,534,194 B2The Johns Hopkins University · 2003