C04B 2237/368
Silicon nitride
C04B2237/368 (Silicon nitride) appears on 735 US grants and 643 published applications in this corpus.
Search patents in C04B- Granted patents
- 735
- Published applications
- 643
- Assignees
- 348
- Inventors
- 1,602
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 4 | 0 |
| 1980 | 2 | 0 |
| 1981 | 6 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 7 | 0 |
| 1985 | 8 | 0 |
| 1986 | 12 | 0 |
| 1987 | 12 | 0 |
| 1988 | 17 | 0 |
| 1989 | 17 | 0 |
| 1990 | 17 | 0 |
| 1991 | 21 | 0 |
| 1992 | 21 | 0 |
| 1993 | 9 | 0 |
| 1994 | 14 | 0 |
| 1995 | 9 | 0 |
| 1996 | 8 | 0 |
| 1997 | 7 | 0 |
| 1998 | 11 | 0 |
| 1999 | 24 | 0 |
| 2000 | 14 | 0 |
| 2001 | 17 | 7 |
| 2002 | 12 | 14 |
| 2003 | 11 | 13 |
| 2004 | 10 | 20 |
| 2005 | 11 | 16 |
| 2006 | 9 | 12 |
| 2007 | 5 | 12 |
| 2008 | 7 | 12 |
| 2009 | 8 | 22 |
| 2010 | 11 | 12 |
| 2011 | 9 | 15 |
| 2012 | 10 | 24 |
| 2013 | 10 | 24 |
| 2014 | 14 | 25 |
| 2015 | 26 | 25 |
| 2016 | 23 | 29 |
| 2017 | 22 | 43 |
| 2018 | 26 | 34 |
| 2019 | 36 | 23 |
| 2020 | 26 | 39 |
| 2021 | 26 | 43 |
| 2022 | 27 | 51 |
| 2023 | 27 | 43 |
| 2024 | 42 | 34 |
| 2025 | 33 | 30 |
| 2026 | 21 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composite ceramic substrate having multi-layer configuration29 Sep 2026US 12,747,191 B2Tong Hsing Electronic Industries, Ltd.
- Metal-ceramic substrate, method for the production thereof, and module28 Jul 2026US 12,692,202 B2Heraeus Electronics GmbH & Co. KG
- Method for manufacturing silicon nitride substrate14 Jul 2026US 12,679,774 B2Oci Company Ltd.
- Bonded substrate14 Jul 2026US 12,679,778 B2NGK Insulators, Ltd.
- Polymer-derived ceramic thin film thermocouple and preparation method thereof9 Jun 2026US 12,652,955 B2
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method13 Aug 2026US 2026/0239541 A1
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
- Copper-ceramic substrate with an upper face which can be sintered13 Aug 2026US 2026/0240018 A1Heraeus Electronics GmbH & Co. KG
- Highly-insulated ingot mold6 Aug 2026US 2026/0225283 A1HarbisonWalker International Holdings, Inc.
Most cited
By later US patents
- Solid freeform fabrication methods283US 5,738,817 ARutgers, The State University · 1998
- Solid freeform fabrication methods223US 5,900,207 ARutgers, the State University Old Queens · 1999
- Ceramic structural body188US 5,914,187 AIbiden Co., Ltd. · 1999
- Functionally stepped, resistive ceramic163US 5,880,439 APhilip Morris Incorporated · 1999
- Composite materials156US 4,055,451 A1977