B32B 2457/08
Pcbs, i.e. printed circuit boards
Official title: PCBs, i.e. printed circuit boards
B32B2457/08 (Pcbs, i.e. printed circuit boards) appears on 1,457 US grants and 1,795 published applications in this corpus.
Search patents in B32B- Granted patents
- 1,457
- Published applications
- 1,795
- Assignees
- 709
- Inventors
- 3,956
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 15 | 0 |
| 1977 | 6 | 0 |
| 1978 | 8 | 0 |
| 1979 | 3 | 0 |
| 1980 | 5 | 0 |
| 1981 | 8 | 0 |
| 1982 | 9 | 0 |
| 1983 | 9 | 0 |
| 1984 | 9 | 0 |
| 1985 | 13 | 0 |
| 1986 | 9 | 0 |
| 1987 | 17 | 0 |
| 1988 | 11 | 0 |
| 1989 | 15 | 0 |
| 1990 | 22 | 0 |
| 1991 | 13 | 0 |
| 1992 | 21 | 0 |
| 1993 | 8 | 0 |
| 1994 | 15 | 0 |
| 1995 | 11 | 0 |
| 1996 | 9 | 0 |
| 1997 | 19 | 0 |
| 1998 | 26 | 0 |
| 1999 | 20 | 0 |
| 2000 | 30 | 0 |
| 2001 | 17 | 6 |
| 2002 | 24 | 22 |
| 2003 | 27 | 33 |
| 2004 | 16 | 34 |
| 2005 | 17 | 39 |
| 2006 | 12 | 55 |
| 2007 | 22 | 49 |
| 2008 | 9 | 27 |
| 2009 | 19 | 71 |
| 2010 | 17 | 71 |
| 2011 | 25 | 51 |
| 2012 | 40 | 49 |
| 2013 | 35 | 58 |
| 2014 | 28 | 59 |
| 2015 | 28 | 97 |
| 2016 | 42 | 100 |
| 2017 | 63 | 104 |
| 2018 | 67 | 129 |
| 2019 | 82 | 111 |
| 2020 | 106 | 104 |
| 2021 | 82 | 152 |
| 2022 | 90 | 103 |
| 2023 | 88 | 87 |
| 2024 | 77 | 66 |
| 2025 | 62 | 61 |
| 2026 | 31 | 57 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition and prepreg, film with resin, metal foil with resin, metal-clad laminated plate, and wiring board using same15 Sep 2026US 12,735,543 B2Panasonic Intellectual Property Management Co., Ltd.
- Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil8 Sep 2026US 12,729,451 B2Fukuda Metal Foil & Powder Co., Ltd.
- Method for producing wiring board25 Aug 2026US 12,721,211 B2Mitsui Kinzoku Company, Limited
- Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor18 Aug 2026US 12,709,083 B2Resonac Corporation
- Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing method4 Aug 2026US 12,698,369 B2
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Ceramic circuit board and manufacturing method therefor1 Oct 2026US 2026/0304591 A1Niterra Materials Co., Ltd.
- Thermosetting resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, antenna device, antenna module, and communication device24 Sep 2026US 2026/0285008 A1Resonac Corporation
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semi-conductor package24 Sep 2026US 2026/0286119 A1Resonac Corporation
Most cited
By later US patents
- Thin electronic device having an integrated circuit chip and a power battery and a method for producing same188US 5,055,968 ASony Corporation · 1991
- Method for manufacturing a stretchable electronic device167US 8,207,473 B2Imec · 2012
- Peeling method and method of manufacturing semiconductor device137US 7,351,300 B2Semiconductor Energy Laboratory Co.Ltd. · 2008
- Methods for fabricating flexible circuit structures99US 6,391,220 B1Fujitsu Limited · 2002
- Cards and devices with embedded holograms90US 8,567,679 B1Dynamics Inc. · 2013