B29C 2043/3438
Moving during dispensing over the moulds
Official title: {moving during dispensing over the moulds, e.g. laying up}
B29C2043/3438 (Moving during dispensing over the moulds) appears on 51 US grants and 56 published applications in this corpus.
Search patents in B29C- Granted patents
- 51
- Published applications
- 56
- Assignees
- 53
- Inventors
- 141
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 2 |
| 2002 | 2 | 6 |
| 2003 | 1 | 4 |
| 2004 | 3 | 4 |
| 2005 | 2 | 1 |
| 2006 | 2 | 3 |
| 2007 | 0 | 1 |
| 2008 | 2 | 3 |
| 2009 | 0 | 3 |
| 2010 | 0 | 3 |
| 2011 | 2 | 1 |
| 2012 | 2 | 1 |
| 2013 | 1 | 3 |
| 2014 | 2 | 1 |
| 2015 | 1 | 1 |
| 2016 | 0 | 1 |
| 2017 | 2 | 1 |
| 2018 | 0 | 1 |
| 2019 | 4 | 1 |
| 2020 | 0 | 2 |
| 2021 | 1 | 3 |
| 2022 | 2 | 3 |
| 2023 | 1 | 1 |
| 2024 | 2 | 3 |
| 2025 | 2 | 2 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus and method for the manufacture of noodles19 May 2026US 12,629,715 B2Short Brothers PLC
- System and method for manufacturing a semiconductor package structure10 Mar 2026US 12,575,441 B2Advanced Semiconductor Engineering, Inc.
- Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed product4 Mar 2025US 12,240,153 B2Apic Yamada Corporation
- Molding resin to form continuous structures21 Jan 2025US 12,202,177 B2Velcro IP Holdings LLC
- Molding resin to form continuous structures14 May 2024US 11,981,057 B2Velcro IP Holdings LLC
- System and method for manufacturing a semiconductor package structure16 Jul 2026US 2026/0206635 A1Advanced Semiconductor Engineering, Inc.
- Molding apparatus and method19 Jun 2025US 2025/0196406 A1Global Polymer Industries, Inc.
- Method for manufacturing resin-sealed product10 Apr 2025US 2025/0114984 A1Apic Yamada Corporation
- Apparatus and Method for the Manufacture of Noodles17 Oct 2024US 2024/0342743 A1Short Borthers PLC
- Molding resin to form continuous structures8 Aug 2024US 2024/0262020 A1Velcro IP Holdings LLC
Most cited
By later US patents
- Micro lens array, method of fabricating the same, and display device41US 6,297,911 B1Seiko Epson Corporation · 2001
- Process for preparing a molded article23US 6,852,268 B1University of Massachusetts · 2005
- Method of forming a motor vehicle dash insulator20US 5,922,265 ALear Corporation · 1999
- Process for preparing a molded article19US 6,132,669 AThe Elizabeth and Sandor Valyi Foundation, Inc. · 2000
- Method for producing closure gaskets17US 5,686,040 AWhite Cap, Inc. · 1997