Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed product

A resin sealing apparatus comprising:

• a resin supply apparatus for supplying a resin onto an object to be coated which is arranged in a lower mold of a resin sealing mold, the resin supply apparatus comprising:
• a processor configured for:
• calculating a resin supply pattern based on a shape of a cavity of the resin sealing mold;
• and
• supplying a resin to the object to be coated along the resin supply pattern,
• wherein the resin supply pattern has a plurality of linear paths arranged in a first direction,
• one of mutually adjacent linear paths in the plurality of linear paths is inclined from the first direction toward a second direction and is inclined with respect to an axis of symmetry that divides the cavity in line symmetry, wherein the first direction and the second direction are on a same plane, and the second direction is perpendicular to the first direction,
• the other one of the mutually adjacent linear paths in the plurality of linear paths is inclined from the first direction toward a direction opposite to the second direction and is inclined with respect to the one of the mutually adjacent linear paths, and
• a region between the mutually adjacent linear paths in the plurality of linear paths is opened to an outside of the object to be coated, at least on a side of the cavity on which the other one of the mutually adjacent linear paths is separated from the one of the mutually adjacent linear paths,
• wherein the resin supply pattern is formed as a pattern by repeatedly folding back inclined linear paths;
• and
• the resin sealing mold for sealing elements on a workpiece with the resin,
• wherein the resin sealing mold has the cavity in which the resin is filled and a plurality of air vents for discharging air from the cavity, and
• the object to be coated is arranged in the resin sealing mold so that an extension of at least one of the plurality of air vents arranged radially at a peripheral edge of the resin sealing mold is located within the region between the one of and the other one of mutually adjacent linear paths in the plurality of linear paths.