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US 12,575,441 B2Granted
System and method for manufacturing a semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChenghan She
Life of this patent
Estimating the term…
Abstract
A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.
Claims16
A method for manufacturing a package structure, comprising:
- providing a carrier;
- dispensing a first molding powder on a first region of the carrier;
- and
- dispensing a second molding powder on a second region of the carrier distinct from the first region of the carrier after controlling a second amount of the second molding powder, wherein the second region is spaced apart from the first region, and the second region and the first region are in substantially concentric shapes.
1 more element
A method for manufacturing a package structure, comprising:
- providing a carrier and a device disposed on the carrier;
- weighing a first molding powder;
- adjusting an amount of the first molding powder before dispensing the first molding powder on the carrier, wherein adjusting the amount of the first molding powder includes:
- increasing or decreasing the amount of the first molding powder according to a result of weighing the first molding powder;
- and
- dispensing the first molding powder on the carrier.
3 more elements
A method for manufacturing a package structure, comprising:
- providing a carrier;
- dispensing a first molding powder on the carrier;
- weighing a second molding powder after dispensing the first molding powder on the carrier, and controlling a second amount of the second molding powder according to a result of weighing the second molding powder;
- and
- dispensing the second molding powder on the carrier after weighing the second molding powder.
2 more elements
Dependencies are inferred from the claim text.