B28D 5/028
With a ring blade having an inside cutting edge
Official title: {with a ring blade having an inside cutting edge}
B28D5/028 (With a ring blade having an inside cutting edge) appears on 58 US grants and 1 published applications in this corpus.
Search patents in B28D- Granted patents
- 58
- Published applications
- 1
- Assignees
- 28
- Inventors
- 66
- Latest grant
- 25 Dec 2001
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 7 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for fabricating silicon semiconductor discrete wafer25 Dec 2001US 6,332,833 B1Naoetsu Electronics Company
- Method for fabricating silicon semiconductor discrete wafer23 May 2000US 6,066,562 ANaoetsu Electronics Company
- Method of producing semiconductor wafers2 Nov 1999US 5,975,990 AWacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Method and apparatus for slicing a work11 May 1999US 5,902,171 AToyo Advanced Technologies Co., Ltd.
- Slicing machine with built-in grinder17 Nov 1998US 5,836,808 ATokyo Seimitsu Co., Ltd.
Most cited
By later US patents
- Control of internal diameter saw blade tension in situ34US 4,502,459 ATexas Instruments Incorporated · 1985
- Method for measuring saw blade flexure31US 4,498,345 ATexas Instruments Incorporated · 1985
- Apparatus for manufacturing thin wafers of hard, non-metallic material such as for use as semiconductor substrates27US 4,896,459 AGMN Georg Muller Nurnberg GmbH · 1990
- Kerf loss reduction in internal diameter sawing26US 4,501,258 ATexas Instruments Incorporated · 1985
- Multiple-blade internal-hole saw for sawing crystalline rods26US 4,633,847 AWacker-Chemie Gesellschaft fur Elektronik-Grundstoffe mbH · 1987