B28D 5/027
With a cutting blade arranged underneath a stationary work table
Official title: {with a cutting blade arranged underneath a stationary work table}
B28D5/027 (With a cutting blade arranged underneath a stationary work table) appears on 4 US grants and 4 published applications in this corpus.
Search patents in B28D- Granted patents
- 4
- Published applications
- 4
- Assignees
- 3
- Inventors
- 6
- Latest grant
- 7 Jul 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 0 |
| 2019 | 1 | 1 |
| 2020 | 1 | 0 |
By publication year.
Recent patents
- Semiconductor sawing method and system7 Jul 2020US 10,703,016 B2Texas Instruments Incorporated
- Machine tool23 Apr 2019US 10,265,883 B2Imer International S.p.A.
- Methods of making an inkjet print head by sawing discontinuous slotted recesses20 Nov 2018US 10,131,147 B2STMicroelectronics S.r. l.
- Methods of making an inkjet print head by sawing discontinuous slotted recesses24 May 2016US 9,346,273 B2STMicroelectronics S.r. l.
- Semiconductor Sawing Method and System26 Dec 2019US 2019/0389091 A1Texas Instruments Incorporated
- Machine tool20 Apr 2017US 2017/0106563 A1Imer International S.p.A.
- Methods of making an inkjet print head by sawing discontinuous slotted recesses10 Mar 2016US 2016/0067970 A1STMicroelectronics S.r. l.
- Methods of making an inkjet print head by sawing discontinuous slotted recesses4 Dec 2014US 2014/0356991 A1STMicroelectronics S.r. l.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.