Methods of making an inkjet print head by sawing discontinuous slotted recesses
AssigneeSTMicroelectronics S.r.l.
InventorKENNETH J. STEWART
Life of this patent
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Abstract
A method of making an inkjet print head may include forming, by sawing with a rotary saw blade, first discontinuous slotted recesses in a first surface of a wafer. The first discontinuous slotted recesses may be arranged in parallel, spaced apart relation. The method may further include forming, by sawing with the rotary saw blade, second discontinuous slotted recesses in a second surface of the wafer aligned and coupled in communication with the first continuous slotted recesses to define through-wafer channels. In another embodiment, the first and second plurality of discontinuous recesses may be formed by respective first and second rotary saw blades.
Claims20
1-21. (canceled)
A method of making an inkjet print head comprising:
- advancing a first rotary saw blade along a first plurality of parallel paths while periodically plunging and retracting the first rotary saw blade along each path to form a first plurality of spaced apart slotted recesses in a first surface of a wafer;
- and
- advancing a second rotary saw blade along a second plurality of parallel paths while periodically plunging and retracting the second rotary saw blade along each path to form a second plurality of spaced apart slotted recesses in a second surface of the wafer coupled in communication with the first plurality of slotted recesses to define a plurality of through-wafer channels.
A method of making an inkjet print head comprising:
- advancing a first rotary saw blade along a first plurality of parallel paths while periodically plunging and retracting the first rotary saw blade along each path to form a first plurality of spaced apart slotted recesses in a first surface of a silicon wafer;
- and
- advancing a second rotary saw blade along a second plurality of parallel paths while periodically plunging and retracting the second rotary saw blade along each path to form a second plurality of spaced apart slotted recesses in a second surface of the silicon wafer coupled in communication with the first plurality of slotted recesses to define a plurality of through-wafer channels;
- the first and second pluralities of slotted recesses being formed by making overlapping cuts into the silicon wafer with the first and second rotary saw blades.
A method of making an inkjet print head comprising:
- advancing a first rotary saw blade along a first plurality of parallel paths while periodically plunging and retracting the first rotary saw blade along each path to form a first plurality of spaced apart slotted recesses in a first surface of a silicon wafer;
- and
- advancing a second rotary saw blade along a second plurality of parallel paths while periodically plunging and retracting the second rotary saw blade along each path to form a second plurality of spaced apart slotted recesses in a second surface of the silicon wafer coupled in communication with the first plurality of slotted recesses to define a plurality of through-wafer channels;
- the first plurality of slotted recesses being formed to have a depth into the silicon wafer greater than a depth of the second plurality of slotted recesses.
Dependencies are inferred from the claim text.