Methods of making an inkjet print head by sawing discontinuous slotted recesses
AssigneeSTMicroelectronics S.r.l.
InventorKenneth J. Stewart
Life of this patent
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Abstract
A method of making an inkjet print head may include forming, by sawing with a rotary saw blade, first discontinuous slotted recesses in a first surface of a wafer. The first discontinuous slotted recesses may be arranged in parallel, spaced apart relation. The method may further include forming, by sawing with the rotary saw blade, second discontinuous slotted recesses in a second surface of the wafer aligned and coupled in communication with the first continuous slotted recesses to define through-wafer channels. In another embodiment, the first and second plurality of discontinuous recesses may be formed by respective first and second rotary saw blades.
Claims21
A method of making an inkjet print head comprising:
- forming, by sawing with a rotary saw blade, a first plurality of discontinuous slotted recesses in a first surface of a wafer along a first parallel path of a plurality thereof of the rotary saw blade so that the first plurality of discontinuous slotted recesses are aligned along the first parallel path;
- and
- forming, by sawing with the rotary saw blade, a second plurality of discontinuous slotted recesses in a second surface of the wafer along a second parallel path of a plurality thereof of the rotary saw blade so that second plurality of discontinuous slotted recesses are aligned along the second parallel path and coupled in communication with the first plurality of discontinuous slotted recesses to define a plurality of through-wafer channels.
A method of making an inkjet print head comprising:
- forming, by sawing with a rotary saw blade, a first plurality of discontinuous slotted recesses in a first surface of a silicon wafer along a first parallel path of a plurality thereof of the rotary saw blade so that the first plurality of discontinuous slotted recesses are aligned along the first parallel;
- and
- forming, by sawing with the rotary saw blade, a second plurality of discontinuous slotted recesses in a second surface of the silicon wafer along a second parallel path of a plurality thereof of the rotary saw blade so that second plurality of discontinuous slotted recesses are aligned along the second parallel path and coupled in communication with the first plurality of continuous slotted recesses to define a plurality of through-wafer channels;
- the first and second plurality of discontinuous slotted recesses being formed by making overlapping cuts into the silicon wafer with the rotary saw blade.
A method of making an inkjet print head comprising:
- forming, by sawing with a rotary saw blade, a first plurality of discontinuous slotted recesses in a first surface of and partly through a wafer along a first parallel path of a plurality thereof of the rotary saw blade so that the first plurality of discontinuous slotted recesses are aligned along the first parallel path;
- and
- forming, by sawing with the rotary saw blade, a second plurality of discontinuous slotted recesses in a second surface of and partly through the wafer along a second parallel path of a plurality thereof of the rotary saw blade so that second plurality of discontinuous slotted recesses are aligned along the second parallel path and coupled in communication with the first plurality of discontinuous slotted recesses to define a plurality of through-wafer channels.
Dependencies are inferred from the claim text.