Semiconductor Sawing Method and System

A method of manufacturing an integrated circuit, the method comprising:

• sawing a semiconductor wafer into separate die along one or more streets formed on the semiconductor wafer;
• wherein the method of sawing a semiconductor wafer into separate die comprises:
• cutting the semiconductor wafer along the one or more streets to form a plurality of die, wherein the semiconductor wafer has a first side and a second side, and wherein the first side is exposed,
• applying a first fluid at a location proximate to where the semiconductor wafer is being cut for cooling, and
• ejecting, at least during sawing, a second fluid across substantially all of the first side of the semiconductor wafer in a layer of fluid to remove any of the first fluid that would otherwise be standing on the first side of the semiconductor wafer;
• attaching the plurality of die to a plurality of leadframes;
• interconnecting each of the plurality of die to a corresponding leadframe of the plurality of leadframes;
• and
• applying to each leadframe a mold compound over at least a portion of any die on the leadframe and at least a portion of the leadframe.

A method for dicing a semiconductor wafer into separate die, the method comprising:

• mounting the semiconductor wafer on a moveable cutting table;
• cutting the semiconductor wafer;
• ejecting a clearing fluid across an exposed side of the semiconductor wafer at least during cutting, with full coverage across the semiconductor wafer, wherein full coverage means that at least 90 percent of the exposed side has the clearing fluid move across the exposed side, and wherein ejecting the clearing fluid is to remove any other liquid fluids from standing on the exposed side of the semiconductor wafer;
• wherein ejecting a clearing fluid includes forming substantially a layer of clearing fluid that traverses the semiconductor wafer substantially parallel to the plane of the exposed side of the semiconductor wafer to remove any fluids on the exposed side of the semiconductor wafer.