B28D 1/22
Working stone or stone-like materials: by cutting
Official title: by cutting, e.g. incising
B28D1/22 (Working stone or stone-like materials: by cutting) appears on 480 US grants and 493 published applications in this corpus.
Search patents in B28D- Granted patents
- 480
- Published applications
- 493
- Assignees
- 259
- Inventors
- 875
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 7 | 0 |
| 1990 | 6 | 0 |
| 1991 | 9 | 0 |
| 1992 | 9 | 0 |
| 1993 | 6 | 0 |
| 1994 | 9 | 0 |
| 1995 | 6 | 0 |
| 1996 | 8 | 0 |
| 1997 | 8 | 0 |
| 1998 | 6 | 0 |
| 1999 | 4 | 0 |
| 2000 | 12 | 0 |
| 2001 | 9 | 5 |
| 2002 | 17 | 13 |
| 2003 | 13 | 17 |
| 2004 | 14 | 27 |
| 2005 | 14 | 19 |
| 2006 | 14 | 29 |
| 2007 | 10 | 19 |
| 2008 | 10 | 23 |
| 2009 | 8 | 25 |
| 2010 | 15 | 24 |
| 2011 | 17 | 23 |
| 2012 | 16 | 15 |
| 2013 | 17 | 19 |
| 2014 | 25 | 19 |
| 2015 | 10 | 23 |
| 2016 | 10 | 11 |
| 2017 | 11 | 17 |
| 2018 | 15 | 37 |
| 2019 | 17 | 13 |
| 2020 | 18 | 16 |
| 2021 | 13 | 15 |
| 2022 | 11 | 15 |
| 2023 | 8 | 19 |
| 2024 | 10 | 21 |
| 2025 | 15 | 17 |
| 2026 | 11 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for removing dousing tank of heavy water reactor structure11 Aug 2026US 12,706,226 B2Korea Hydro & Nuclear Power Co., Ltd.
- Mechanism with cams for engraving and splitting tiles7 Jul 2026US 12,673,446 B2Ambrogiani, Valter
- Cutting method and cutting device for scoring components made of glass or ceramics and method for dividing components made of glass or ceramics23 Jun 2026US 12,662,411 B2HEGLA GmbH & Co. KG
- System for manufacturing a bevelled stone, particularly for a horological movement23 Jun 2026US 12,663,759 B2Comadur SA
- Floor cutting machine31 Mar 2026US 12,589,522 B2Egun Co., Ltd.
- Slab cutting system13 Aug 2026US 2026/0233431 A1Raimondi S.P.A.
- Support for a continuous strip produced during heat chamfering of glass substrate, related methods, and glass substrate produced therefrom13 Aug 2026US 2026/0234047 A1Corning Incorporated
- Method for producing an optical system for a lithography apparatus, substrate for an optical component of a lithography apparatus, and lithography apparatus30 Jul 2026US 2026/0216920 A1Carl Zeiss SMT GmbH
- Material display system and method23 Jul 2026US 2026/0208383 A1Michael Ryan
- Machine and method for cutting slabs made of stone or ceramic or glass material16 Jul 2026US 2026/0200135 A1
Most cited
By later US patents
- Block splitter assembly163US 6,321,740 B1Anchor Wall Systems, Inc. · 2001
- Laser cutting apparatus and method154US 6,407,360 B1Samsung Electronics Co., Ltd. · 2002
- Creation of a parting zone in a crystal structure148US 4,546,231 AGroup II Manufacturing Ltd. · 1985
- Method for laser-scribing brittle substrates and apparatus therefor139US 6,787,732 B1Seagate Technology LLC · 2004
- Dual laser cutting of wafers137US 6,562,698 B2Kulicke & Soffa Investments, Inc. · 2003