B28D 1/221
By thermic methods
Official title: {by thermic methods}
B28D1/221 (By thermic methods) appears on 136 US grants and 152 published applications in this corpus.
Search patents in B28D- Granted patents
- 136
- Published applications
- 152
- Assignees
- 78
- Inventors
- 288
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 3 |
| 2002 | 5 | 8 |
| 2003 | 9 | 7 |
| 2004 | 10 | 14 |
| 2005 | 4 | 7 |
| 2006 | 7 | 16 |
| 2007 | 3 | 6 |
| 2008 | 1 | 5 |
| 2009 | 5 | 7 |
| 2010 | 4 | 6 |
| 2011 | 3 | 3 |
| 2012 | 7 | 7 |
| 2013 | 7 | 4 |
| 2014 | 8 | 6 |
| 2015 | 3 | 5 |
| 2016 | 3 | 6 |
| 2017 | 1 | 4 |
| 2018 | 6 | 11 |
| 2019 | 5 | 3 |
| 2020 | 6 | 3 |
| 2021 | 4 | 4 |
| 2022 | 3 | 1 |
| 2023 | 3 | 4 |
| 2024 | 2 | 5 |
| 2025 | 1 | 4 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Glass film production method, glass roll production method, and glass film production device24 Mar 2026US 12,583,781 B2Nippon Electric Glass Co., Ltd.
- Heat chamfering apparatus and method17 Mar 2026US 12,577,142 B2Corning Incorporated
- Heat chamfering apparatus and method10 Feb 2026US 12,545,615 B2Corning Incorporated
- Heat chamfering apparatus and method7 Oct 2025US 12,434,992 B2Corning Incorporated
- Method for forming a crack in an edge region of a donor substrate24 Sep 2024US 12,097,641 B2Siltectra GmbH
- Support for a continuous strip produced during heat chamfering of glass substrate, related methods, and glass substrate produced therefrom13 Aug 2026US 2026/0234047 A1Corning Incorporated
- Incident radiation induced subsurface damage for controlled crack propagation in material cleavage28 May 2026US 2026/0145266 A1Halo Industries, Inc.
- Laser-less dicing method30 Apr 2026US 2026/0115825 A1NXP USA, Inc.
- Method of shaping a carrier sheet of high hardness7 Aug 2025US 2025/0249652 A1Sensonic Design Zrt.
- Thermal break for concrete slabs10 Jul 2025US 2025/0222624 A1
Most cited
By later US patents
- Laser cutting apparatus and method154US 6,407,360 B1Samsung Electronics Co., Ltd. · 2002
- Creation of a parting zone in a crystal structure148US 4,546,231 AGroup II Manufacturing Ltd. · 1985
- Method for laser-scribing brittle substrates and apparatus therefor139US 6,787,732 B1Seagate Technology LLC · 2004
- Dual laser cutting of wafers137US 6,562,698 B2Kulicke & Soffa Investments, Inc. · 2003
- Laser beam processing machine124US 6,998,571 B2Disco Corporation · 2006