B24D 3/346
Utilised during polishing, or grinding operation
Official title: {utilised during polishing, or grinding operation}
B24D3/346 (Utilised during polishing, or grinding operation) appears on 149 US grants and 131 published applications in this corpus.
Search patents in B24D- Granted patents
- 149
- Published applications
- 131
- Assignees
- 97
- Inventors
- 404
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 10 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 4 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 0 |
| 2002 | 7 | 8 |
| 2003 | 10 | 3 |
| 2004 | 2 | 3 |
| 2005 | 2 | 4 |
| 2006 | 1 | 0 |
| 2007 | 2 | 2 |
| 2008 | 0 | 3 |
| 2009 | 0 | 7 |
| 2010 | 0 | 4 |
| 2011 | 1 | 4 |
| 2012 | 1 | 4 |
| 2013 | 4 | 2 |
| 2014 | 2 | 4 |
| 2015 | 3 | 3 |
| 2016 | 0 | 2 |
| 2017 | 2 | 3 |
| 2018 | 3 | 13 |
| 2019 | 5 | 20 |
| 2020 | 8 | 16 |
| 2021 | 10 | 5 |
| 2022 | 9 | 7 |
| 2023 | 9 | 5 |
| 2024 | 2 | 4 |
| 2025 | 5 | 5 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Additives for grinding semiconductor workpieces21 Apr 2026US 12,610,767 B2Wolfspeed, Inc.
- Surface clean system and method29 Jul 2025US 12,370,648 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Abrasive article with microparticle-coated abrasive grains20 May 2025US 12,304,028 B23M Innovative Properties Company
- Buffing spherocylinder made of compressed material15 Apr 2025US 12,275,120 B2Lake Country Manufacturing, Inc.
- Abrasive article, abrasive system and method for using and forming same18 Feb 2025US 12,226,876 B2Saint-Gobain Abrasifs
- Surface clean system and method2 Oct 2025US 2025/0303521 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Disc Grinding for Semiconductor Wafers on Polishing System11 Sep 2025US 2025/0282021 A1Wolfspeed, Inc.
- Additives for Grinding Semiconductor Workpieces11 Sep 2025US 2025/0285873 A1Wolfspeed, Inc.
- Sheet-like abrasive article24 Jul 2025US 2025/0235985 A1Kovax Corporation
- Coated abrasive article having spacer particles, making method and apparatus therefor10 Apr 2025US 2025/0114912 A13M Innovative Properties Company
Most cited
By later US patents
- Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith446US 4,770,671 AMinnesota Mining and Manufacturing Company · 1988
- Abrasive article comprising an antiloading component126US 5,954,844 AMinnesota Mining and Manufacturing Company · 1999
- Light weight abrasive tumbling media and method of making same118US 5,049,166 AWashington Mills Ceramics Corporation · 1991
- Engineered abrasives116US 6,451,076 B1Saint-Gobain Abrasives Technology Company · 2002
- Compositions and methods for polishing and planarizing surfaces110US 5,264,010 ARodel, Inc. · 1993