B24B 55/02
Equipment for cooling the grinding surfaces
Official title: Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant (cooling or lubricating during dressing operation B24B53/095; incorporated in grinding wheels B24D)
B24B55/02 (Equipment for cooling the grinding surfaces) appears on 429 US grants and 459 published applications in this corpus.
Search patents in B24B- Granted patents
- 429
- Published applications
- 459
- Assignees
- 303
- Inventors
- 1,108
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 7 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 7 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 10 | 0 |
| 1999 | 4 | 0 |
| 2000 | 12 | 0 |
| 2001 | 17 | 4 |
| 2002 | 11 | 11 |
| 2003 | 15 | 13 |
| 2004 | 10 | 13 |
| 2005 | 5 | 10 |
| 2006 | 10 | 11 |
| 2007 | 5 | 11 |
| 2008 | 5 | 19 |
| 2009 | 11 | 12 |
| 2010 | 9 | 8 |
| 2011 | 8 | 16 |
| 2012 | 10 | 8 |
| 2013 | 11 | 15 |
| 2014 | 8 | 12 |
| 2015 | 5 | 22 |
| 2016 | 18 | 18 |
| 2017 | 12 | 24 |
| 2018 | 21 | 36 |
| 2019 | 17 | 35 |
| 2020 | 21 | 21 |
| 2021 | 13 | 29 |
| 2022 | 10 | 20 |
| 2023 | 23 | 30 |
| 2024 | 19 | 24 |
| 2025 | 15 | 25 |
| 2026 | 20 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wafer grinding method6 Oct 2026US 12,752,389 B2Disco Corporation
- Fluid dispensing device with coupling to power-driven turning tools and turning tool comprising the same29 Sep 2026US 12,746,630 B2
- Coating removal apparatus and method22 Sep 2026US 12,741,353 B2Yield Engineering Systems, Inc.
- Polishing apparatus for substrate and polishing method for substrate using the same1 Sep 2026US 12,722,250 B2Samsung Electronics Co., Ltd.
- Cooling mechanism4 Aug 2026US 12,698,931 B2Disco Corporation
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Polishing apparatus and polishing table10 Sep 2026US 2026/0264195 A1Micro Engineering Inc.
- Method of cleaning an aluminum wheel18 Jun 2026US 2026/0166676 A1International Marketing, Inc.
- Superhard material abrasive tool and grinding process for difficult-to-machine materials18 Jun 2026US 2026/0166679 A1Guilin Champion Union Diamond Co., Ltd.
- Universal attachable water directing device for power tools4 Jun 2026US 2026/0151890 A1Crowne Tools LLC
Most cited
By later US patents
- Slurry recycling in CMP apparatus155US 5,664,990 AIntegrated Process Equipment Corp. · 1997
- Rinse water recycling in CMP apparatus99US 5,755,614 AIntegrated Process Equipment Corp. · 1998
- Radial uniformity control of semiconductor wafer polishing88US 5,036,630 AInternational Business Machines Corporation · 1991
- Apparatus for planarizing a dielectric formed over a semiconductor substrate71US 5,127,196 AIntel Corporation · 1992
- Apparatus for improving flatness of polished wafers67US 4,313,284 AMonsanto Company · 1982