US 5,127,196 AGranted

Apparatus for planarizing a dielectric formed over a semiconductor substrate

AssigneeIntel Corporation

InventorsSeiichi Morimoto, Robert J. Patterson

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Abstract

An improved method for planarizing the surface of an dielectric deposited over a semiconductor substrate. The substrate is pressed face down against a table which has been coated with an abrasive material. In this way, the upper surface of the interlayer dielectric contacts the abrasive. Rotational movement of the wafer relative to the table facilitates removal of the protruding portions of the interlayer dielectric by the abrasive. Post-planarization step height variation is minimized by simultaneously cooling the table and the abrasive material during the abrasive or polishing process. By maintaining the table and the abrasive at about 10 degrees Celcius the step height variation is reduced by a factor of 2 over that normally realized in the prior art.

Claims8

Dependent claims

An apparatus for planarizing the upper surface of a dielectric deposited on a semiconductor substrate comprising:

a table having a top surface comprising a porous material capable of absorbing particulate matter;
means for pressing said substrate against said table such that said upper surface of said dielectric contacts said top surface of said table;
means for delivering an abrasive material to said top surface of said table;
means for moving said substrate over said top surface to allow said abrasive material to wear away portions of said dielectric by friction such that said upper surface of said dielectric becomes substantially planar;
and
a single means for cooling both said table and said abrasive material to a temperature substantially below room temperature to minimize thickness variations in said dielectric during planarization.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 07/658,019Filed 20 Feb 1991 · division
Priority: 1 Mar 1990
Granted: 7 Jul 1992
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

B24B 37/107
The workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement: in a rotary movement only,…
B24B 49/14
Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring…
B24B 55/02
Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the…
H10P 95/062
Planarisation of inorganic insulating materials: involving a dielectric removal step