B24B 41/047
Grinding heads for working on plane surfaces
B24B41/047 (Grinding heads for working on plane surfaces) appears on 268 US grants and 253 published applications in this corpus.
Search patents in B24B- Granted patents
- 268
- Published applications
- 253
- Assignees
- 176
- Inventors
- 553
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 5 | 0 |
| 1997 | 8 | 0 |
| 1998 | 3 | 0 |
| 1999 | 17 | 0 |
| 2000 | 16 | 0 |
| 2001 | 18 | 6 |
| 2002 | 9 | 8 |
| 2003 | 7 | 9 |
| 2004 | 8 | 6 |
| 2005 | 7 | 7 |
| 2006 | 9 | 8 |
| 2007 | 4 | 9 |
| 2008 | 5 | 6 |
| 2009 | 4 | 8 |
| 2010 | 3 | 15 |
| 2011 | 3 | 5 |
| 2012 | 8 | 6 |
| 2013 | 9 | 10 |
| 2014 | 5 | 4 |
| 2015 | 1 | 4 |
| 2016 | 8 | 5 |
| 2017 | 5 | 8 |
| 2018 | 8 | 17 |
| 2019 | 10 | 17 |
| 2020 | 5 | 14 |
| 2021 | 9 | 17 |
| 2022 | 7 | 12 |
| 2023 | 7 | 20 |
| 2024 | 15 | 15 |
| 2025 | 18 | 10 |
| 2026 | 2 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Sanding tool with intermediate adapter pad28 Apr 2026US 12,611,748 B2Full Circle International, Inc.
- Surface processing device and methods of use thereof7 Apr 2026US 12,594,638 B2Wagman Metal Products, Inc.
- Trimming tool and method of use9 Dec 2025US 12,491,599 B2
- Substrate warpage correction method, computer storage medium, and substrate warpage correction apparatus9 Dec 2025US 12,491,600 B2Tokyo Electron Limited
- Glass for magnetic recording medium substrate or for glass spacer to be used in magnetic recording/reproducing device, magnetic recording medium substrate, magnetic recording medium, and magnetic recording/reproducing apparatus18 Nov 2025US 12,473,225 B2Hoya Corporation
- Substrate polishing system23 Jul 2026US 2026/0208317 A1Samsung Electronics Co., Ltd.
- Trimming tool and method of use7 May 2026US 2026/0124688 A1
- Grinding apparatus23 Apr 2026US 2026/0108999 A1Samsung Electronics Co., Ltd.
- Processing device2 Apr 2026US 2026/0091464 A1Sumitomo Heavy Industries Finetech, Ltd.
- Glass for magnetic recording medium substrate or for glass spacer to be used in magnetic recording/reproducing device, magnetic recording medium substrate, magnetic recording medium, and magnetic recording/reproducing apparatus26 Feb 2026US 2026/0055020 A1Hoya Corporation
Most cited
By later US patents
- Polishing pads for a semiconductor substrate104US 6,126,532 ACabot Corporation · 2000
- Polishing pads and methods relating thereto88US 6,022,268 ARodel Holdings, Inc. · 2000
- Polishing pad for a semiconductor substrate78US 6,062,968 ACabot Corporation · 2000
- Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads67US 5,990,012 AMicron Technology, Inc. · 1999
- Polishing pad and methods relating thereto67US 6,022,264 ARodel, Inc. · 2000