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US 6,022,268 AGranted
Polishing pads and methods relating thereto
AssigneeRodel Holdings, Inc.
InventorsJohn V. H. Roberts, David B. James, Lee Melbourne Cook
Life of this patent
Estimating the term…
Abstract
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
Claims21
A polishing pad comprising:
- a hydrophilic polishing layer having no intrinsic ability to absorb or transport a plurality of slurry particles, said polishing layer having a polishing surface consisting essentially of a polishing material having:
- i. a density greater than 0.5 g/cm.sup.3 ;
- ii. a critical surface tension greater than or equal to 34 milliNewtons per meter;
- iii. a tensile modulus of 0.02 to 5 GigaPascals;
- iv. a ratio of tensile modulus at 30.degree. C. to tensile modulus at 60.degree. C. of 1.0 to 2.5;
- v. a hardness of 25 to 80 Shore D;
- vi. a yield stress of 300-6000 psi;
- vii. a tensile strength of 1000 to 15,000 psi;
- and
- viii. an elongation to break less than or equal to 500%,
- said polishing material comprising at least one moiety from the group consisting of:
- 1. a urethane produced by a catalyst which accelerates an isocyanate reaction, said catalyst being devoid of copper, tungsten, iron or chromium;
- 2. a carbonate;
- 3. an amide;
- 4. an ester;
- 5. an ether;
- 6. an acrylate;
- 7. a methacrylate;
- 8. an acrylic acid;
- 9. a methacrylic acid;
- 10. a sulphone;
- 11. an acrylamide;
- 12. a halide;
- and 13. a hydroxide, and
- said polishing surface having a random surface topography and having a macro-texture produced by solidifying a flowable material.
22 more elements
A polishing pad for use in chemical mechanical polishing, comprising:
- a polishing layer consisting essentially of a hydrophilic polishing layer having no intrinsic ability to absorb a plurality of slurry particles, said polishing layer having a continuous or discontinuous polishing surface consisting essentially of a polishing material having:
- i. a density greater than 0.5 g/cm.sup.3 ;
- ii. a critical surface tension greater than or equal to 34 milliNewtons per meter;
- iii. a tensile modulus of 0.02 to 5 GigaPascals;
- iv. a ratio of tensile modulus at 30.degree. C. to tensile modulus at 60.degree. C. of 1.0 to 2.5;
- v. a hardness of 25 to 80 Shore D;
- vi. a yield stress of 300-6000 psi;
- vii. a tensile strength of 1000 to 15,000 psi;
- and
- viii. an elongation to break less than or equal to 500%,
- said polishing layer comprising a surface texture having at least one groove and a polishing surface adjacent to said groove, said groove defining a width of at least 0.01 millimeters, a depth of at least 0.01 millimeters and a length of at least 0.1 millimeters, said surface texture having a transition region, said transition region being a portion of the surface texture which transitions from the polishing surface to a boundary surface of said groove, said boundary surface of said groove lying on a first plane which is different from a second plane upon which the polishing surface lies, said transition region being defined by a portion of the polishing surface which bridges between the first and second plane, the transition region of the entire polishing surface having less than 10 macro-defects of greater than 25 microns per millimeter of groove length.
8 more elements
Dependencies are inferred from the claim text.