Substrate warpage correction method, computer storage medium, and substrate warpage correction apparatus

A computer-readable storage medium storing a program running on a computer of a controller configured to control a surface roughening processing apparatus to cause the surface roughening processing apparatus to perform a warpage correction method for correcting warpage of a plurality of substrates,

• the warpage correction method comprising
• for each substrate of the plurality of substrates, before a surface roughening process, measuring a warpage amount in a warpage protruding to a front surface side of a substrate, and deciding a polishing pressure in advance based on a positive correlation between the polishing pressure and the warpage amount which is measured,
• for each substrate of the plurality of substrates, performing the surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate, and
• after the performing of the surface roughening process on the rear surface, stopping the performing of the surface roughening process and performing a transfer-out from the surface roughening processing apparatus of the substrate with the grooves only on the rear surface, wherein
• the performing of the surface roughening process on the rear surface forms grooves in the rear surface of the substrate at the polishing pressure throughout the surface roughening process for the substrate, the polishing pressure positively correlated in advance to the warpage amount in the warpage protruding to the front surface side of the substrate measured before the surface roughening process.

A warpage correction apparatus for correcting warpage of a plurality of substrates configured to perform, for each substrate of the plurality of substrates, a surface roughening process on a rear surface of a substrate to form grooves in the rear surface to thereby correct the warpage of the substrate, the warpage correction apparatus comprising:

• a sliding member configured to rotate around a vertical axis in order to slide on the rear surface of the substrate to thereby perform a process;
• a drive relating to the sliding member;
• and
• a controller configured to
• for each substrate of the plurality of substrates, before the surface roughening process, measuring a warpage amount in a warpage protruding to a front surface side of a substrate, and deciding a polishing pressure in advance based on a positive correlation between the polishing pressure and the warpage amount which is measured,
• control the drive so as to perform at least one of:
• the surface roughening process by the sliding member at the polishing pressure according to the warpage amount of the substrate;
• the surface roughening process by the sliding member configured to spin at a spin speed according to the warpage amount of the substrate;
• the surface roughening process by the sliding member comprising a contact surface with the rear surface of the substrate, the contact surface having a surface roughness according to the warpage amount of the substrate;
• and the surface roughening process on a process region based on information about a distribution of the warpage of the substrate within the substrate, and
• after the performing of the surface roughening process on the rear surface, stop the performing of the surface roughening process and perform a transfer-out from the warpage correction apparatus of the substrate with the grooves only on the rear surface, wherein
• the performing of the surface roughening process on the rear surface forms grooves in the rear surface of the substrate at the polishing pressure throughout the surface roughening process for the substrate, the polishing pressure positively correlated in advance to the warpage amount in the warpage protruding to a front surface side of the substrate measured before the surface roughening process.