B24B 37/28
For double side lapping of plane surfaces
Official title: for double side lapping of plane surfaces
B24B37/28 (For double side lapping of plane surfaces) appears on 96 US grants and 104 published applications in this corpus.
Search patents in B24B- Granted patents
- 96
- Published applications
- 104
- Assignees
- 58
- Inventors
- 211
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 0 |
| 2002 | 4 | 2 |
| 2003 | 1 | 1 |
| 2004 | 1 | 2 |
| 2005 | 0 | 1 |
| 2006 | 3 | 2 |
| 2007 | 1 | 5 |
| 2008 | 1 | 5 |
| 2009 | 4 | 7 |
| 2010 | 1 | 5 |
| 2011 | 6 | 10 |
| 2012 | 8 | 9 |
| 2013 | 3 | 7 |
| 2014 | 7 | 6 |
| 2015 | 11 | 8 |
| 2016 | 5 | 3 |
| 2017 | 6 | 2 |
| 2018 | 2 | 4 |
| 2019 | 1 | 5 |
| 2020 | 0 | 3 |
| 2021 | 3 | 3 |
| 2022 | 7 | 2 |
| 2023 | 2 | 3 |
| 2024 | 1 | 3 |
| 2025 | 3 | 3 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and disk carrier for use in polishing glass substrate disks7 Apr 2026US 12,594,645 B2Western Digital Technologies, Inc.
- Apparatus for double-side polishing work10 Feb 2026US 12,544,874 B2Sumco Corporation
- Carrier and method for manufacturing substrate5 Aug 2025US 12,377,514 B2Hoya Corporation
- Double-side or one-side machine tool3 Jun 2025US 12,318,883 B2Lapmaster Wolters GmbH
- Glass article and method of producing glass article1 Apr 2025US 12,263,555 B2AGC Inc.
- Substrate processing method and substrate processing apparatus17 Sep 2026US 2026/0282843 A1Tokyo Electron Limited
- Double-side polishing apparatus for workpiece and double-side polishing method for workpiece14 May 2026US 2026/0131416 A1Sumco Corporation
- Double or single-sided processing machine26 Mar 2026US 2026/0084261 A1Lapmaster Wolters GmbH
- Polishing apparatus and polishing method10 Apr 2025US 2025/0114904 A1Disco Corporation
- Wafer double-side polishing apparatus and method of evaluating the same27 Mar 2025US 2025/0100102 A1SK Siltron Co., Ltd.
Most cited
By later US patents
- Method and apparatus for polishing a workpiece72US 7,004,827 B1Komag, Inc. · 2006
- Lapping means and method57US 4,940,507 AMotorola, Inc. · 1990
- Semiconductor wafer polisher and method52US 5,422,316 AMEMC Electronic Materials, Inc. · 1995
- Flat lapping machine37US 4,805,348 ASpeedfam Corporation · 1989
- Substrate retainer37US 7,459,057 B2APPLIED Materials.Inc. · 2008