B23K 35/3013
Au as the principal constituent
Official title: {Au as the principal constituent}
B23K35/3013 (Au as the principal constituent) appears on 244 US grants and 257 published applications in this corpus.
Search patents in B23K- Granted patents
- 244
- Published applications
- 257
- Assignees
- 171
- Inventors
- 624
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 8 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 7 | 3 |
| 2002 | 8 | 2 |
| 2003 | 3 | 11 |
| 2004 | 5 | 8 |
| 2005 | 8 | 10 |
| 2006 | 4 | 6 |
| 2007 | 2 | 11 |
| 2008 | 7 | 11 |
| 2009 | 3 | 10 |
| 2010 | 8 | 14 |
| 2011 | 9 | 12 |
| 2012 | 5 | 11 |
| 2013 | 7 | 13 |
| 2014 | 9 | 12 |
| 2015 | 6 | 16 |
| 2016 | 7 | 15 |
| 2017 | 16 | 28 |
| 2018 | 12 | 22 |
| 2019 | 18 | 6 |
| 2020 | 14 | 4 |
| 2021 | 12 | 8 |
| 2022 | 4 | 8 |
| 2023 | 9 | 7 |
| 2024 | 6 | 4 |
| 2025 | 1 | 2 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Manufacturing method of light-emitting device, and light-emitting device14 Jul 2026US 12,683,353 B2Nichia Corporation
- Stable undercooled metallic particles for filling a void24 Feb 2026US 12,559,824 B2Iowa State University Research Foundation, Inc.
- Method of assembling substrate supporting apparatus5 Aug 2025US 12,377,483 B2Wonik Ips Co., Ltd.
- Method and apparatus for flexible circuit cable attachment31 Dec 2024US 12,185,476 B2Jabil Inc.
- Junction structure, method for manufacturing junction structure, and solder ball3 Dec 2024US 12,157,189 B2Nippon Micrometal Corporation
- Solder ball13 Aug 2026US 2026/0233346 A1Nippon Micrometal Corporation
- Gold paste, and method for producing gold paste9 Jul 2026US 2026/0192401 A1Tanaka Kikinzoku Kogyo K.K.
- Brazed joints and methods thereof4 Jun 2026US 2026/0151841 A1
- Joint and method of joining23 Oct 2025US 2025/0326044 A1Tokamak Energy Ltd
- Thin film for semiconductor laser bonding and method for producing same23 Oct 2025US 2025/0326069 A1Citizen Finedevice Co., Ltd.
Most cited
By later US patents
- Brazing-filler material and method for brazing diamond107US 6,889,890 B2Hohoemi Brains, Inc. · 2005
- High melting point process for Au:Sn:80:20 brazing alloy for chip carriers80US 4,418,857 AInternational Business Machines Corporation · 1983
- Bonded member comprising different materials, and production method thereof65US 6,918,530 B2NGK Insulators, Ltd. · 2005
- Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device62US 8,653,384 B2Greatbatch Ltd. · 2014
- Sputter target59US 4,209,375 AThe United States of America as represented by the United States Department of Energy · 1980