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US 4,209,375 AGranted
Sputter target
AssigneeThe United States of America as represented by the United States Department of Energy
InventorsWillard G. Gates, Gerald J. Hale
Life of this patent
Estimating the term…
Abstract
The disclosure relates to an improved sputter target for use in the deposition of hard coatings. An exemplary target is given wherein titanium diboride is brazed to a tantalum backing plate using a gold-palladium-nickel braze alloy.
Claims8
A vacuum sputter deposition process for depositing material from a sputter target onto a substrate at temperatures as high as 700.degree. C. comprising:
- (1) forming said target comprising a layer of sputterable material having thickness T and a thermal expansivity A;
- a metal layer having a thickness about 0.06 T and a thermal expansivity about A;
- and a metallic layer intermediate and metallurgically bonded to said sputterable layer and said metal layer and having a melting point greater than 700.degree. C. and a thickness about 0.02T;
- and (2) sputtering said layer of sputterable material.
1 more element
A spall-resistant sputter target for use in vacuum sputter deposition at temperatures as high at 700.degree. C. comprising:
- a sputterable layer of titanium diboride, a support layer of tantalum, a layer of an alloy comprising 70% gold, 8% palladium, and 22% nickel intermediate and metallurgically bonding together said first and second layers.
Dependencies are inferred from the claim text.