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US 12,157,189 B2Granted
Junction structure, method for manufacturing junction structure, and solder ball
AssigneesNippon Steel Chemical & Material Co., Ltd., Nippon Micrometal Corporation
InventorsMasamoto Tanaka, Kiyotsugu Komori, Keisuke Akashi, Katsuhiko Hoshino, Tsunekazu Yamazaki, Takayuki Kobayashi, Sukeyoshi Yamamoto, Kensuke Misawa
Life of this patent
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Abstract
Provided is a joint structure. The joint structure includes a first structure, and a second structure joined to the first structure via a joint portion formed of a Au—Sn-based alloy, wherein a thickness of the joint portion is 3 μm or more and 50 μm or less.
Claims16
A joint structure comprising:
- a first structure;
- and
- a second structure joined to the first structure via a joint portion formed of a Au—Sn-based alloy, wherein
- a thickness of the joint portion is 3 μm or more and 50 μm or less,
- the joint portion contains:
- Sn of 19 mass % or more and 25 mass % or less;
- a balance containing Au as a main component;
- and
- any one element of Fe, Cr, and Ni,
- a concentration of Fe in a case of containing Fe is 0.1 ppm by mass or more and 10 ppm by mass or less, a concentration of Cr in a case of containing Cr is 0.1 ppm by mass or more and 100 ppm by mass or less, and a concentration of Ni in a case of containing Ni is 1 ppm by mass or more and 5,000 ppm by mass or less, with respect to the entire joint portion.
7 more elements
A joint structure comprising:
- a first structure;
- and
- a second structure joined to the first structure via a joint portion formed of a Au—Sn-based alloy, wherein
- a thickness of the joint portion is 3 μm or more and 50 μm or less, wherein
- the joint portion contains:
- Sn of 19 mass % or more and 25 mass % or less;
- a balance containing Au as a main component;
- and
- a combination of at least two or more elements selected from Fe, Cr, and Ni,
- a total concentration of the combination of the elements with respect to the entire joint portion is more than 0.1 ppm by mass and 5,000 ppm by mass or less,
- a concentration of Fe in a case of containing Fe is 0.1 ppm by mass or more and 10 ppm by mass or less, a concentration of Cr in a case of containing Cr is 0.1 ppm by mass or more and 100 ppm by mass or less, and a concentration of Ni is in a range of 0 ppm by mass or more and 4,990 ppm by mass or less.
8 more elements
A method for manufacturing a joint structure,
- the joint structure including:
- a first structure;
- and
- a second structure joined to the first structure via a joint portion formed of a Au—Sn-based alloy,
- the method comprising:
- a ball fixing step of fixing a solder ball formed of the Au—Sn-based alloy to a first joint surface of the first structure;
- and
- a step of turning over the first structure with respect to the second structure with the first joint surface facing the second joint surface of the second structure to electrically connect the first joint surface and the second joint surface, wherein a thickness of the joint portion is 3 μm or more and 50 μm or less.
5 more elements
A solder ball comprising:
- Sn of 19 mass % or more and 25 mass % or less;
- and
- a balance containing Au as a main component, wherein
- the solder ball contains any one element of Fe, Cr, and Ni,
- a concentration of Fe in a case of containing Fe is 0.1 ppm by mass or more and 10 ppm by mass or less, a concentration of Cr in a case of containing Cr is 0.1 ppm by mass or more and 100 ppm by mass or less, and a concentration of Ni in a case of containing Ni is 1 ppm by mass or more and 5,000 ppm by mass or less, with respect to the entire solder ball.
2 more elements
A solder ball comprising:
- Sn of 19 mass % or more and 25 mass % or less;
- and
- a balance containing Au as a main component, wherein
- the solder ball contains a combination of at least two or more elements selected from Fe, Cr, and Ni,
- a total concentration of a combination of the elements is more than 0.1 ppm by mass and 5,000 ppm by mass or less with respect to the entire solder ball, a concentration of Fe in a case of containing Fe is 0.1 ppm by mass or more and 10 ppm by mass or less, a concentration of Cr in a case of containing Cr is 0.1 ppm by mass or more and 100 ppm by mass or less, and a concentration of Ni is in a range of 0 ppm by mass or more and 4,990 ppm by mass or less.
2 more elements
A solder ball comprising:
- Sn of 19 mass % or more and 25 mass % or less;
- and
- a balance containing Au as a main component, wherein
- a central cross section of the solder ball includes a lamellar structure composed of a first phase mainly composed of Au5Sn and a second phase mainly composed of AuSn, and
- in four frames having a square shape and evenly disposed in a circumferential direction of the solder ball, the frame having, as a diagonal line, a line segment having a length of 5 μm from a position where a line passing through a center of the solder ball and parallel to the central cross section intersects with an outer edge of the solder ball toward the center,
- an average number of the first phases being massive and having longitudinal and lateral lengths two times or more an interval between the first phase and the second phase is three or less.
3 more elements
Dependencies are inferred from the claim text.