Method of assembling substrate supporting apparatus
AssigneeWonik Ips Co., Ltd.
InventorKyu Tae Cho
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Abstract
Disclosed herein is a method of assembling a substrate supporting apparatus, including coupling a conductive rod to an electrode installed in a substrate support provided to support a substrate, forming a sacrificial layer on the rod, bonding the rod and the electrode by melting and infiltrating a filler into a coupling area between the rod and the electrode, while forming a protective layer between the rod and the sacrificial layer by infiltrating the filler into a gap between the rod and the sacrificial layer, and coupling a shaft to the substrate support, the rod extending through the shaft.
Claims9
A method of assembling a substrate supporting apparatus, the method comprising:
- coupling a conductive rod to an electrode installed in a substrate support provided to support a substrate;
- forming a sacrificial layer that surrounds the rod;
- bonding the rod and the electrode by melting and infiltrating a filler into a coupling area between the rod and the electrode, while forming a protective layer between the rod and the sacrificial layer by infiltrating the filler into a gap between the rod and the sacrificial layer;
- and
- coupling a shaft to the substrate support, the rod extending through the shaft.
Dependencies are inferred from the claim text.