B23K 3/085
Cooling, heat sink or heat shielding means
Official title: {Cooling, heat sink or heat shielding means}
B23K3/085 (Cooling, heat sink or heat shielding means) appears on 130 US grants and 139 published applications in this corpus.
Search patents in B23K- Granted patents
- 130
- Published applications
- 139
- Assignees
- 89
- Inventors
- 372
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 5 | 5 |
| 2003 | 4 | 4 |
| 2004 | 2 | 1 |
| 2005 | 0 | 2 |
| 2006 | 0 | 1 |
| 2007 | 2 | 2 |
| 2008 | 0 | 2 |
| 2009 | 4 | 5 |
| 2010 | 0 | 1 |
| 2011 | 2 | 3 |
| 2012 | 2 | 6 |
| 2013 | 1 | 3 |
| 2014 | 3 | 2 |
| 2015 | 4 | 14 |
| 2016 | 12 | 10 |
| 2017 | 10 | 13 |
| 2018 | 8 | 6 |
| 2019 | 7 | 3 |
| 2020 | 4 | 6 |
| 2021 | 3 | 10 |
| 2022 | 9 | 7 |
| 2023 | 5 | 11 |
| 2024 | 5 | 7 |
| 2025 | 13 | 9 |
| 2026 | 7 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Jet soldering apparatus8 Sep 2026US 12,728,470 B2Senju Metal Industry Co., Ltd.
- Tabbing device for manufacturing solar battery module8 Sep 2026US 12,728,471 B2Hanwha Solutions Corporation
- Substrate processing apparatus14 Jul 2026US 12,678,882 B2Samsung Electronics Co., Ltd.
- Soldering apparatus including a shuttered light source7 Jul 2026US 12,673,378 B2Samsung Electronics Co., Ltd.
- Semiconductor processing tool and methods of operation14 Apr 2026US 12,599,983 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Process Chamber with UV Irradiance30 Jul 2026US 2026/0216806 A1Yield Engineering Systems, Inc.
- Mold for forming solder distal tip for guidewire9 Jul 2026US 2026/0192093 A1Abbott Cardiovascular Systems Inc.
- Soldering device and tabbing apparatus comprising same9 Jul 2026US 2026/0192378 A1Hanwha Solutions Corporation
- Laser compression bonding device7 May 2026US 2026/0124691 A1STATS ChipPAC Management Pte. Ltd.
- Desoldering equipment12 Mar 2026US 2026/0070140 A1Fu Tai Hua Industry (Shenzhen) Co., Ltd.
Most cited
By later US patents
- Methods and apparatus for installing a module on a circuit board using heating and cooling techniques26US 6,347,734 B1EMC Corporation · 2002
- Internal pipeline cooler26US 9,821,415 B2CRC-Evans Pipeline International, Inc. · 2017
- Reflow method and reflow device19US 6,145,734 AMatsushita Electric Industrial Co., Ltd. · 2000
- Soldering apparatus with improved filter17US 5,481,087 ASoltec B.V. · 1996
- Cooling and exhaust unit for solder reflow system15US 4,912,857 AElectrovert Ltd. · 1990