Methods and apparatus for installing a module on a circuit board using heating and cooling techniques

A method for installing a module on a circuit board, the method comprising the steps of:

• positioning the module on an installation location of the circuit board, the module having a perimeter portion and an inner portion;
• and
• simultaneously heating the perimeter portion of the module, and cooling the inner portion of the module in order to install the module on the circuit board, wherein the step of simultaneously heating and cooling includes the steps of (i) applying a first fluid to an area adjacent the perimeter portion of the module, and (ii) applying a second fluid to an area adjacent the inner portion of the module, wherein the step of applying the first fluid includes the step of:
• providing a gas, as the first fluid, to the area adjacent the perimeter portion of the module;
• and wherein the step of applying the second fluid includes the step of:
• providing a liquid, as the second fluid, to the area adjacent the inner portion of the module.

A method for installing a module on a circuit board, the method comprising the steps of:

• positioning the module on an installation location of the circuit board, the module having a perimeter portion and an inner portion;
• and
• simultaneously heating the perimeter portion of the module, and cooling the inner portion of the module in order to install the module on the circuit board, wherein the step of simultaneously heating and cooling includes the steps of (i) applying a first fluid to an area adjacent the perimeter portion of the module, and (ii) applying a second fluid to an area adjacent the inner portion of the module, wherein the step of applying the second fluid includes the step of:
• passing the second fluid through a chamber of a housing which is in contact with the inner portion of the module.

A module installation system for installing a module on a circuit board, the module having a perimeter portion and an inner portion, the module installation system comprising:

• a heating source;
• a cooling source;
• and
• a nozzle, coupled to the heating and cooling sources, that is configured to simultaneously (i) heat the perimeter portion of the module, and (ii) cool the inner portion of the module in order to install the module on the circuit board.

A module installation system for installing a module on a circuit board, the module having a perimeter portion and an inner portion, the module installation system comprising:

• a heating source;
• a cooling source;
• and
• means, coupled to the heating and cooling sources, for simultaneously heating the perimeter portion of the module, and cooling the inner portion of the module such that the perimeter portion moves to a substantially different temperature than that of the inner portion in order to install the module on the circuit board.

A module installation system for installing a module on a circuit board, the module having a first portion and a second portion, the module installation system comprising:

• a first heating source;
• a second heating source;
• and
• a nozzle, coupled to the first and second heating sources, that is configured to simultaneously (i) heat the first portion of the module to a first temperature, and (ii) heat the second portion of the module to a second temperature that is lower than the first temperature, in order to install the module on the circuit board.