B23K 26/18
Working by laser beam: using absorbing layers on the workpiece
Official title: using absorbing layers on the workpiece, e.g. for marking or protecting purposes
B23K26/18 (Working by laser beam: using absorbing layers on the workpiece) appears on 427 US grants and 431 published applications in this corpus.
Search patents in B23K- Granted patents
- 427
- Published applications
- 431
- Assignees
- 305
- Inventors
- 1,244
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 7 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 7 | 0 |
| 1988 | 2 | 0 |
| 1989 | 14 | 0 |
| 1990 | 10 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 6 | 0 |
| 1997 | 2 | 0 |
| 1998 | 14 | 0 |
| 1999 | 11 | 0 |
| 2000 | 12 | 0 |
| 2001 | 11 | 5 |
| 2002 | 14 | 17 |
| 2003 | 17 | 18 |
| 2004 | 16 | 24 |
| 2005 | 13 | 23 |
| 2006 | 9 | 14 |
| 2007 | 9 | 19 |
| 2008 | 4 | 12 |
| 2009 | 7 | 13 |
| 2010 | 12 | 12 |
| 2011 | 7 | 11 |
| 2012 | 8 | 14 |
| 2013 | 5 | 19 |
| 2014 | 10 | 24 |
| 2015 | 12 | 14 |
| 2016 | 15 | 19 |
| 2017 | 22 | 27 |
| 2018 | 9 | 18 |
| 2019 | 14 | 19 |
| 2020 | 18 | 20 |
| 2021 | 11 | 20 |
| 2022 | 12 | 25 |
| 2023 | 12 | 17 |
| 2024 | 8 | 8 |
| 2025 | 18 | 14 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Water washable thermal and plasma resistant coating for laser interactive applications22 Sep 2026US 12,742,076 B2
- Substrate processing apparatus and substrate processing method25 Aug 2026US 12,721,107 B2Tokyo Electron Limited
- Laser processing method18 Aug 2026US 12,713,860 B2Hamamatsu Photonics K.K.
- Processing apparatus using laser, method of laser lift-off and method of manufacturing semiconductor device23 Jun 2026US 12,666,921 B2Kioxia Corporation
- Surface treatment method for magnesium alloy hub6 Jan 2026US 12,515,280 B2CITIC Dicastal Co., Ltd.
- Processing apparatus using laser, method of laser lift-off and method of manufacturing semiconductor device24 Sep 2026US 2026/0293602 A1Kioxia Corporation
- Method for producing a prismatic battery cell, prismatic battery cell and motor vehicle10 Sep 2026US 2026/0269434 A1PowerCo SE
- Substrate processing apparatus and substrate processing method12 Feb 2026US 2026/0042171 A1Tokyo Electron Limited
- Weld assembly with weld-aid coating and preparation method for the weld assembly29 Jan 2026US 2026/0027652 A1
- High speed laser processes for marking articles in motion, and marked articles1 Jan 2026US 2026/0001164 A1The Procter & Gamble Company
Most cited
By later US patents
- Method and apparatus for direct laser cutting of metal stents552US 5,780,807 AAdvanced Cardiovascular Systems, Inc. · 1998
- Ultrashort pulse high repetition rate laser system for biological tissue processing480US 5,720,894 AThe Regents of the University of California · 1998
- Method and apparatus for direct laser cutting of metal stents361US 5,759,192 AAdvanced Cardiovascular Systems, Inc. · 1998
- Method and apparatus for high precision variable rate material removal and modification344US 6,156,030 AY-Beam Technologies, Inc. · 2000
- Method for laser thermal processing using thermally induced reflectivity switch269US 6,635,588 B1Ultratech Stepper, Inc. · 2003