Substrate processing apparatus and substrate processing method

A substrate processing apparatus configured to process a combined substrate in which a first substrate, an interface layer including at least a laser absorption layer, and a second substrate are stacked, the substrate processing apparatus comprising:

• a substrate holder configured to hold the combined substrate;
• a laser radiator configured to radiate laser light to the combined substrate held by the substrate holder;
• a moving mechanism configured to horizontally move the substrate holder and the laser radiator relative to each other;
• a rotating mechanism including a motor and configured to rotate the substrate holder;
• and
• a controller having a processor and a memory with a computer readable program stored therein,
• wherein an outer peripheral region including a non-bonding region of the first substrate and the second substrate, and an inner peripheral region disposed inside the outer peripheral region in a radial direction in a bonding region of the first substrate and the second substrate are set in the combined substrate, and
• the controller executes:
• a control of causing separation at an interface between the first substrate and the laser absorption layer or at an interface between the interface layer and the laser absorption layer by radiating the laser light to the combined substrate while rotating the combined substrate and moving the laser light in the radial direction;
• and
• a control of radiating, at least in the outer peripheral region, the laser light while moving the laser light from an inner side toward an outer side in the radial direction.