B23K 10/003
Scarfing, desurfacing or deburring
Official title: {Scarfing, desurfacing or deburring}
B23K10/003 (Scarfing, desurfacing or deburring) appears on 41 US grants and 61 published applications in this corpus.
Search patents in B23K- Granted patents
- 41
- Published applications
- 61
- Assignees
- 46
- Inventors
- 168
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 2 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 2 | 2 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 2 | 1 |
| 2014 | 1 | 5 |
| 2015 | 1 | 1 |
| 2016 | 2 | 4 |
| 2017 | 3 | 3 |
| 2018 | 1 | 8 |
| 2019 | 4 | 5 |
| 2020 | 5 | 2 |
| 2021 | 3 | 6 |
| 2022 | 1 | 2 |
| 2023 | 1 | 2 |
| 2024 | 3 | 3 |
| 2025 | 2 | 5 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Localized heating device and localized heating system having the same9 Jun 2026US 12,652,733 B2Industrial Technology Research Institute
- Surface processing equipment2 Jun 2026US 12,646,696 B2Industrial Technology Research Institute
- Work processing apparatus25 Mar 2025US 12,257,641 B2Fujikoshi Machinery Corp.
- Apparatus and method for cleaning oxide film18 Feb 2025US 12,226,845 B2Doosan Enerbility Co., Ltd.
- Surface processing equipment and surface processing method26 Nov 2024US 12,154,768 B2Industrial Technology Research Institute
- Automated sphere plate pressing method16 Jul 2026US 2026/0199948 A1CB&I STS Delaware LLC
- Laser-less dicing method30 Apr 2026US 2026/0115825 A1NXP USA, Inc.
- Blade unit and cleaning apparatus for removing slag simultaneously from opposite sides of a slat22 Jan 2026US 2026/0021513 A1TRUMPF Schweiz AG
- Method for Plasma Cutting Workpieces8 May 2025US 2025/0144735 A1Kjellberg-Stiftung
- High-precision heterogeneous integration27 Mar 2025US 2025/0105009 A1Board of Regents, The University of Texas System
Most cited
By later US patents
- Method and apparatus for plasma processing with control of ion energy distribution at the substrates136US 6,201,208 B1Wisconsin Alumni Research Foundation · 2001
- Plasma generating device and surface processing device and method for processing wafers in a uniform magnetic field86US 5,444,207 AKabushiki Kaisha Toshiba · 1995
- Plasma marking torch and method of operating same23US 6,054,669 AThe ESAB Group, Inc. · 2000
- Atmospheric pressure inductive plasma apparatus13US 6,218,640 B1TimeDomain CVD, Inc. · 2001
- Apparatus and method for controlling etch uniformity13US 8,674,255 B1Lam Research Corporation · 2014