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US 2025/0105009 A1Published application
High-precision heterogeneous integration
AssigneeBoard of Regents, The University of Texas System
InventorsSidlgata V. Sreenivasan, Paras Ajay
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Abstract
A method for implementing high-precision heterogeneous integration. An etch of a first bonding surface and a second bonding surface is performed to create nanostructures in the first bonding surface and/or the second bonding surface. The first and second bonding surfaces are bonded together, where a particle lands at a bonding interface resulting in an exclusion zone that is at least two times smaller than a bonding of two bonding surfaces with no nanostructures.
Claims11
A method for enhancing a yield of a bonding process, the method comprising:
- performing an etch on one or more of a first bonding surface and a second bonding surface to create nanostructures in said one or more of said first bonding surface and said second bonding surface;
- and
- bonding said first bonding surface with said second bonding surface, wherein a particle lands at a bonding interface resulting in an exclusion zone that is at least two times smaller than a bonding of two bonding surfaces with no nanostructures.
11-23. (canceled)
Dependencies are inferred from the claim text.