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AssigneesToshiro Doi, National University Corporation Nagaoka University of Technology, Fujikoshi Machinery Corp.
InventorsHideo Aida, Hidetoshi Takeda, Toshiro Doi, Tadakazu Miyashita, Atsushi Kajikura
Estimating the term…
A work processing apparatus performs processing of a surface to be processed of a work by causing a processing head to come into sliding contact with the work held on an upper surface of a holding plate. The processing head includes a plasma electrode that generates plasma and radiates the plasma to the surface to be processed of the work. In the plasma electrode, an annular or solid cylindrical central electrode provided at a center in a radial direction and an annular outer circumferential electrode provided at an outer side in the radial direction with respect to the central electrode are arranged with an annular slit portion intermediating therebetween at a boundary position thereof, the slit portion is configured as a plasma generation space, and a processing pad is provided at bottom surfaces of the central electrode and the outer circumferential electrode.
A work processing apparatus configured to perform processing of a surface to be processed of a work by causing a processing head to come into sliding contact with the work held on an upper surface of a holding plate, the work processing apparatus comprising:
Dependencies are inferred from the claim text.