B23K 1/0056
Soldering by means of beams
Official title: {soldering by means of beams, e.g. lasers, electron beams [EB]}
B23K1/0056 (Soldering by means of beams) appears on 482 US grants and 580 published applications in this corpus.
Search patents in B23K- Granted patents
- 482
- Published applications
- 580
- Assignees
- 357
- Inventors
- 1,406
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 7 | 0 |
| 1986 | 3 | 0 |
| 1987 | 6 | 0 |
| 1988 | 6 | 0 |
| 1989 | 3 | 0 |
| 1990 | 11 | 0 |
| 1991 | 9 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 4 | 0 |
| 1998 | 9 | 0 |
| 1999 | 6 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 1 |
| 2002 | 8 | 7 |
| 2003 | 6 | 10 |
| 2004 | 11 | 12 |
| 2005 | 6 | 15 |
| 2006 | 4 | 17 |
| 2007 | 8 | 15 |
| 2008 | 8 | 14 |
| 2009 | 6 | 25 |
| 2010 | 12 | 12 |
| 2011 | 5 | 14 |
| 2012 | 11 | 8 |
| 2013 | 11 | 26 |
| 2014 | 14 | 24 |
| 2015 | 13 | 21 |
| 2016 | 15 | 34 |
| 2017 | 25 | 38 |
| 2018 | 18 | 30 |
| 2019 | 30 | 31 |
| 2020 | 21 | 32 |
| 2021 | 19 | 37 |
| 2022 | 26 | 39 |
| 2023 | 29 | 40 |
| 2024 | 25 | 32 |
| 2025 | 22 | 29 |
| 2026 | 22 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding head and bonding apparatus6 Oct 2026US 12,752,380 B2Pac Tech—Packaging Technologies GmbH
- Repair of solder bumps29 Sep 2026US 12,746,613 B2Orbotech Ltd.
- Laser control structure and laser bonding method using the same25 Aug 2026US 12,715,070 B2Electronics and Telecommunications Research Institute
- Workpiece plating treatment method and workpiece manufacturing method25 Aug 2026US 12,715,073 B2Tyco Electronics (Shanghai) Co., Ltd.
- Method and apparatus for checking a connection during a laser-based connecting method11 Aug 2026US 12,703,042 B2Ford Global Technologies, LLC
- Suction collet and method for manufacturing optical component10 Sep 2026US 2026/0264268 A1Sumitomo Electric Industries, Ltd.
- Laser soldering apparatus having adjustable soldering position and soldering method comprising same20 Aug 2026US 2026/0241473 A1Laservall Technology Co., Ltd
- Laser soldering by pulsed laser13 Aug 2026US 2026/0233335 A1DR Laser Singapore Pte Ltd.
- Brazing process23 Jul 2026US 2026/0208280 A1Optoprim S.R.L.
- Pattern recognition system and method for digital printed circuit board assembly9 Jul 2026US 2026/0197945 A1National Technical University of Athens
Most cited
By later US patents
- Additive manufacturing of active devices using dielectric, conductive and magnetic materials323US 10,254,499 B1Southern Methodist University · 2019
- Sheet-metal composite, method for joining sheets and joining device120US 9,006,605 B2Fft Produktionssysteme GmbH & Co. KG · 2015
- Method of soldering or welding components117US 8,686,314 B2FFT EDAG Produktionssysteme GmbH & Co. KG · 2014
- Laser brazing for ceramic-to-metal joining104US 5,407,119 AAmerican Research Corporation of Virginia · 1995
- Lasersonic soldering of fine insulated wires to heat-sensitive substrates92US 5,298,715 AInternational Business Machines Corporation · 1994