Laser soldering by pulsed laser
AssigneeDR Laser Singapore Pte Ltd.
InventorsChi Hang KWOK, Kit Ying CHAN, Jia Hui CHEOK
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Abstract
According to one aspect of the present disclosure, a method for soldering using pulsed laser light is provided. The method may include receiving, by a processor, a set of input parameters for soldering electronic components formed on a component substrate to solder materials formed on a target substrate. The method may include identifying, by the processor, a set of laser beam parameters for controlling the pulsed laser light based on the set of input parameters. The method may include controlling, by the processor, an application of the pulsed laser light to individually solder each of the electronic components and its corresponding solder material according to the set of laser beam parameters.
Claims20
A method for soldering using pulsed laser light, comprising:
- receiving, by a processor, a set of input parameters for soldering electronic components formed on a component substrate to solder materials formed on a target substrate;
- identifying, by the processor, a set of laser beam parameters for controlling the pulsed laser light based on the set of input parameters;
- and
- controlling, by the processor, an application of the pulsed laser light to individually solder each of the electronic components and its corresponding solder material according to the set of laser beam parameters.
An apparatus for laser soldering, comprising:
- a laser source configured to emit pulsed laser light;
- an optical system configured to focus the pulsed laser light onto a soldering area that includes an individual electronic component;
- and
- a control unit configured to:
- receive a set of input parameters for soldering electronic components formed on a component substrate to solder materials formed on a target substrate;
- identify a set of laser beam parameters for controlling the pulsed laser light based on the set of input parameters;
- and
- cause the laser source to apply the pulsed laser light to individually solder each of the electronic components and its corresponding solder material according to the set of laser beam parameters.
Dependencies are inferred from the claim text.