B23D 57/0046
Of devices for feeding, conveying or clamping work
Official title: {of devices for feeding, conveying or clamping work}
B23D57/0046 (Of devices for feeding, conveying or clamping work) appears on 40 US grants and 24 published applications in this corpus.
Search patents in B23D- Granted patents
- 40
- Published applications
- 24
- Assignees
- 36
- Inventors
- 94
- Latest grant
- 7 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 1 |
| 2004 | 0 | 2 |
| 2005 | 2 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 1 |
| 2011 | 2 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 2 |
| 2015 | 1 | 2 |
| 2016 | 1 | 3 |
| 2017 | 2 | 0 |
| 2018 | 2 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 2 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
| 2024 | 0 | 2 |
| 2025 | 1 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for cutting a shell-type object, a cutter system and a vessel equipped with the cutter system7 Oct 2025US 12,434,312 B2Advantis A/S
- Method and device for cutting a plate or panel of porous construction material10 Jan 2023US 11,548,084 B2Saint-Gobain Placo
- Method and device for cutting a mat or a panel of mineral wool or a board or a panel of porous construction material14 Sep 2021US 11,117,281 B2Saint-Gobain Placo
- Wire saw13 Nov 2018US 10,124,431 B2Komatsu Ntc Ltd.
- Method for slicing semiconductor single crystal ingot23 Jan 2018US 9,876,078 B2Sumco Techxiv Corporation
- Silicon Rod Cutting System7 May 2026US 2026/0124789 A1Qingdao Gaoce Technology Co., Ltd
- Brick loading/unloading apparatus and method15 Aug 2024US 2024/0269893 A1Hanwha Corporation
- Apparatus and method for machining cylindrical grooves by multi-wire cutting of profiles2 May 2024US 2024/0139839 A1Guangzhou dongfuyuan Animal Husbandry Equipment Co., Ltd
- A method for cutting a shell-type object, a cutter system and a vessel equipped with the cutter system16 Mar 2023US 2023/0078101 A1Advantis ApS
- Processing module for a building panel18 Feb 2021US 2021/0046666 A1United Grinding Group Management AG
Most cited
By later US patents
- Multi-wafer slicing with a fixed abrasive200US 4,646,710 ACrystal Systems, Inc. · 1987
- Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece174US 6,295,977 B1Wacker Chemie AG · 2001
- Three-dimensional model-making system55US 4,393,450 ATrustees of Dartmouth College · 1983
- Wire saw and method for cutting wafers from a workpiece42US 5,616,065 AWacker Siltronic Gesellschft fur Halbleitermaterialien Aktiengesellschaft · 1997
- Computer-controlled peripheral shaping system38US 4,675,825 A1987