Back to results
US 10,124,431 B2Granted
Wire saw
AssigneeKomatsu Ntc Ltd.
InventorsHitoshi Shimada, Tomoyuki Kawatsu, Yosuke Yabu, Akira Tanizaki
Life of this patent
Estimating the term…
Abstract
A wire (12) is wound around multiple processing rollers (11) several times. A holding mechanism (13) and a depressing mechanism (25) are provided above an area where the wire (12) is wound. The holding mechanism (13) holds a workpiece (W) elastically and laterally. The depressing mechanism (25) depresses the workpiece (W) held by the holding mechanism (13) toward the wire (12).
Claims5
A wire saw, the wire saw comprising:
- multiple processing rollers and a wire wound around the processing rollers more than once;
- a holding device to hold a workpiece elastically and laterally above an area where the wire is wound;
- and
- a depressing device to depress the workpiece held by the holding device toward the wire,
- wherein the holding device includes a receiving member to receive a side surface of the workpiece and a pressing member to press the workpiece against the receiving member using spring force.
2 more elements
Dependencies are inferred from the claim text.