B23D 57/003
Sawing machines or sawing devices working with saw wires, characterised only by
Official title: {Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts (constructional features of these parts per se B23Q)}
B23D57/003 (Sawing machines or sawing devices working with saw wires, characterised only by) appears on 228 US grants and 188 published applications in this corpus.
Search patents in B23D- Granted patents
- 228
- Published applications
- 188
- Assignees
- 152
- Inventors
- 453
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 7 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 9 | 0 |
| 1999 | 10 | 0 |
| 2000 | 11 | 0 |
| 2001 | 8 | 5 |
| 2002 | 8 | 5 |
| 2003 | 8 | 7 |
| 2004 | 2 | 5 |
| 2005 | 7 | 2 |
| 2006 | 4 | 4 |
| 2007 | 1 | 5 |
| 2008 | 3 | 7 |
| 2009 | 2 | 6 |
| 2010 | 3 | 9 |
| 2011 | 7 | 5 |
| 2012 | 5 | 11 |
| 2013 | 5 | 7 |
| 2014 | 8 | 8 |
| 2015 | 7 | 15 |
| 2016 | 6 | 6 |
| 2017 | 12 | 5 |
| 2018 | 7 | 10 |
| 2019 | 5 | 8 |
| 2020 | 5 | 9 |
| 2021 | 5 | 7 |
| 2022 | 6 | 7 |
| 2023 | 2 | 11 |
| 2024 | 4 | 10 |
| 2025 | 10 | 9 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bearing unit23 Jun 2026US 12,663,044 B2Aktiebolaget Skf
- Spin-saw machine3 Mar 2026US 12,564,891 B2SMO bvba
- System for cooling a cutting wire3 Mar 2026US 12,564,892 B2SMO bvba
- Method for separating multiple slices of workpieces by means of a wire saw during a sequence of separation processes24 Feb 2026US 12,558,731 B2Siltronic AG
- Reciprocating wire saw device10 Feb 2026US 12,544,843 B2
- A rock-cutting apparatus for diamond wire rock-cutting, and a method for blind-cutting rock4 Jun 2026US 2026/0151839 A1Fravizel - Equipamentos MetalomecâNicos, S.A.
- Slicing apparatus and wire-arrangement method thereof28 May 2026US 2026/0145253 A1GlobalWafers Co., Ltd.
- Silicon Rod Cutting System7 May 2026US 2026/0124789 A1Qingdao Gaoce Technology Co., Ltd
- Underwater Cutting Device for Shipwreck Salvage19 Feb 2026US 2026/0048444 A1Zhejiang International Maritime College
- Dry cutting apparatus and cutting method for wall or slab12 Feb 2026US 2026/0042241 A1Egun Co., Ltd.
Most cited
By later US patents
- Wire saw1,029US 8,833,219 B2Illinois Tool Works Inc. · 2014
- Multi-wafer slicing with a fixed abrasive200US 4,646,710 ACrystal Systems, Inc. · 1987
- Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece174US 6,295,977 B1Wacker Chemie AG · 2001
- Oscillatory abrasive cable power saw74US 5,239,978 AThe United States of America as represented by the Secretary of the Navy · 1993
- Three-dimensional model-making system55US 4,393,450 ATrustees of Dartmouth College · 1983