Method for separating multiple slices of workpieces by means of a wire saw during a sequence of separation processes

A method for slicing off a multiplicity of wafers from a workpiece using a wire saw during a sequence of slicing operations subdivided into initial cuts and first and second subsequent cuts, the wire saw comprising a wire web of movable wire sections of a sawing wire and a setting device, the wire web being stretched in a plane between two wire guide rollers, each of the two wire guide rollers being mounted between a fixed bearing and a movable bearing, the method comprising:

• during each one of the sequence of slicing operations, using the setting device, feeding the workpiece through the wire web along a feed direction perpendicular to a workpiece axis and perpendicular to the plane of the wire web in the presence of a working fluid and of hard substances which act abrasively on the workpiece,
• wherein, during each one of the sequence of slicing operations, the movable bearing of each of the two wire guide rollers moves oscillatingly axially,
• wherein the feeding of the workpiece through the wire web comprises a simultaneous displacement of the workpiece along the workpiece axis using a setting element in accordance with a mandate of a correction profile, which comprises an oscillating component which is opposite to the effect which the axial moving of the movable bearing, of each of the two wire guide rollers, has on the shape of the sliced-off wafers, and
• wherein the correction profile, in the case of each one of the first subsequent cuts, includes a second shape profile-based component, which is proportional to a difference of a second average shape profile and of a shaped profile of the reference wafer, and the second average shape profile is determined from wafers which have been sliced off in the course of one or more of the initial cuts in the sequence.