B23D 57/0061
Of devices for guiding or feeding saw wires
Official title: {of devices for guiding or feeding saw wires}
B23D57/0061 (Of devices for guiding or feeding saw wires) appears on 78 US grants and 72 published applications in this corpus.
Search patents in B23D- Granted patents
- 78
- Published applications
- 72
- Assignees
- 54
- Inventors
- 163
- Latest grant
- 3 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 5 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 3 |
| 2004 | 1 | 1 |
| 2005 | 3 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 4 |
| 2008 | 3 | 2 |
| 2009 | 1 | 2 |
| 2010 | 1 | 6 |
| 2011 | 2 | 1 |
| 2012 | 4 | 3 |
| 2013 | 4 | 4 |
| 2014 | 4 | 3 |
| 2015 | 2 | 5 |
| 2016 | 2 | 3 |
| 2017 | 3 | 2 |
| 2018 | 4 | 7 |
| 2019 | 3 | 3 |
| 2020 | 2 | 4 |
| 2021 | 2 | 4 |
| 2022 | 3 | 4 |
| 2023 | 1 | 4 |
| 2024 | 3 | 2 |
| 2025 | 1 | 3 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Spin-saw machine3 Mar 2026US 12,564,891 B2SMO bvba
- System for cooling a cutting wire3 Mar 2026US 12,564,892 B2SMO bvba
- Method for separating multiple slices of workpieces by means of a wire saw during a sequence of separation processes24 Feb 2026US 12,558,731 B2Siltronic AG
- Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes18 Mar 2025US 12,251,767 B2Siltronic AG
- Wire deflector and wire saw26 Nov 2024US 12,151,295 B2Hilti Aktiengesellschaft
- Wire Saw Apparatus For Excavator28 Aug 2025US 2025/0269445 A1Egun Co., Ltd.
- Automatic stroke setting apparatus of cutting device using multi-wire10 Jul 2025US 2025/0222627 A1Hanwha Precision Machinery Co., Ltd.
- Apparatus For Reverse Cutting Process For Nuclear Power Plant Structure10 Apr 2025US 2025/0114974 A1Egun Co., Ltd.
- Cable saw11 Apr 2024US 2024/0116120 A1
- Diamond Wire Saw Dry-Cutting Method15 Feb 2024US 2024/0051183 A1Egun Co., Ltd.
Most cited
By later US patents
- Wire saw1,029US 8,833,219 B2Illinois Tool Works Inc. · 2014
- Multi-wafer slicing with a fixed abrasive200US 4,646,710 ACrystal Systems, Inc. · 1987
- Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece174US 6,295,977 B1Wacker Chemie AG · 2001
- Computer-controlled peripheral shaping system38US 4,675,825 A1987
- Cutting machine29US 4,915,000 A1990