Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
AssigneeSiltronic AG
InventorsPeter Wiesner, Wolfgang Gmach, Robert Kreuzeder
Life of this patent
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AssigneeSiltronic AG
InventorsPeter Wiesner, Wolfgang Gmach, Robert Kreuzeder
Estimating the term…
Slices are cut from workpieces using a wire saw having a wire array tensioned in a plane between two wire guide rollers each supported between fixed and floating bearings and comprising a chamber and a shell enclosing a core and having guide grooves for wires. During a cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed through the wire array while simultaneously: changing shell lengths by adjusting chamber temperatures in dependence on a depth of cut and a first correction profile; and moving the workpiece along the workpiece axis in accordance with a second correction profile. The correction profiles are opposed to a shape deviation.
A method for cutting a multiplicity of slices from a workpiece using a wire saw during a sequence of cut-off operations, which are divided into initial cuts and follow-on cuts, the wire saw comprising:
Dependencies are inferred from the claim text.