B05D 2202/45
Based on cu
Official title: based on Cu
B05D2202/45 (Based on cu) appears on 53 US grants and 77 published applications in this corpus.
Search patents in B05D- Granted patents
- 53
- Published applications
- 77
- Assignees
- 70
- Inventors
- 209
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 1 |
| 2005 | 1 | 2 |
| 2006 | 2 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 3 |
| 2009 | 0 | 4 |
| 2010 | 0 | 2 |
| 2011 | 3 | 0 |
| 2012 | 3 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 2 |
| 2015 | 1 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 1 |
| 2018 | 0 | 1 |
| 2019 | 0 | 6 |
| 2020 | 1 | 14 |
| 2021 | 4 | 6 |
| 2022 | 7 | 8 |
| 2023 | 5 | 6 |
| 2024 | 2 | 5 |
| 2025 | 4 | 7 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for producing film25 Aug 2026US 12,715,038 B2LG Chem.Ltd.
- Abrasion-resistant coatings for thermal interfaces21 Jul 2026US 12,690,170 B2Henkel AG & Co. KGaA
- Powder for an electrically insulating coating26 May 2026US 12,637,585 B2Arkema France
- Process to synthesize/integrate durable/robust low surface energy “hydrophobic” dropwise condensation promoter coatings on metal and metal oxide surfaces14 Apr 2026US 12,600,883 B2The Texas A&M University System
- Film forming method and film forming apparatus31 Mar 2026US 12,589,410 B2Tokyo Electron Limited
- Maleimide resin, resin composition, cured product, sheet, laminate, and printed wiring board1 Oct 2026US 2026/0297264 A1Resonac Corporation
- Syntactic foam compositions1 Oct 2026US 2026/0297388 A1PRC-DeSoto International, Inc.
- Thermosetting resin composition, resin sheet, heat dissipation plate, method for manufacturing resin sheet, and method for manufacturing heat dissipation plate10 Sep 2026US 2026/0265511 A1Arisawa Mfg.Co., Ltd.
- Laminate and method for forming laminate20 Aug 2026US 2026/0241412 A1Daikin Industries, Ltd.
- Passivation coating on copper metal surface for copper wire bonding application26 Feb 2026US 2026/0054287 A1University of North Texas
Most cited
By later US patents
- Three-step plasma treatment of copper foils to enhance their laminate adhesion58US 4,524,089 AOlin Corporation · 1985
- Method of making dimensionally stable composite article37US 6,858,253 B23M Innovative Properties Company · 2005
- Organic-metallic composite coating for copper surface protection22US 5,960,251 AInternational Business Machines Corporation · 1999
- UV oven for curing magnet wire coatings20US 6,345,149 B12002
- Process for improving copper-epoxy adhesion19US 4,428,987 AShell Oil Company · 1984