Film forming method and film forming apparatus
AssigneeTokyo Electron Limited
InventorsZeyuan Ni, Taiki Kato
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Abstract
A film forming method includes preparing a substrate having a first region in which a metal film or an oxide film of the metal film is exposed, and a second region in which an insulating film is exposed, supplying, to the substrate, an organic compound containing, in a head group, a triple bond between carbon atoms represented by Chemical Formula (1) described in the specification, causing the organic compound to be selectively adsorbed in the first region among the first region and the second region, and cleaving the triple bond in the first region and forming a hydrophobic film having a honeycomb structure of carbon atoms through polymerization.
Claims12
A film forming method comprising:
- preparing a substrate having a first region in which a metal film or an oxide film of the metal film is exposed, and a second region in which an insulating film is exposed;
- supplying, to the substrate, an organic compound containing, in a head group, a triple bond between carbon atoms represented by Chemical Formula (1) below, while irradiating the substrate with light;
- causing the organic compound to be selectively adsorbed in the first region among the first region and the second region;
- and
- cyclotrimerizing the organic compounds with the light to form a hydrophobic film having a honeycomb structure of carbon atoms in the first region,
- H—C≡C—R (1)
- wherein, in Chemical Formula (1), R is a hydrophobic functional group containing 1 or more and 16 or less carbon atoms.
Dependencies are inferred from the claim text.