Process for improving copper-epoxy adhesion
AssigneeShell Oil Company
InventorsJames P. Bell, Jae M. Park
Life of this patent
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Abstract
The present invention is directed to a method for improving the adhesion of epoxy resins to copper substrates which comprises pretreating the copper substrate with a solution of a suitable pretreatment compound such as a benzotriazole, benzothiazole, substituted benzotriazoles, etc.
Claims9
A process for improving the adhesion of epoxy resins to a copper substrate which comprises (1) subjecting the substrate to cathodic polarization of from about 1 to about 15 volts for from about one second to about 15 minutes in an electrolytic bath and then immersing the polarized substrate in a 0.001 to 0.1 molar solution of at least one compound of the general formula:
- ##STR8## wherein A is a --N.dbd. or --S--,
- B is a --N.dbd. or --C.dbd.,
- Y is a --N.dbd. or NH.dbd.,
- D is H, --SH, --SR, ##STR9## or R wherein R is an alkyl or aryl radical, and m is an integer from 0 to 10, and X is H, --NH.sub.2, ##STR10## or --OH for from about 1 second to about one hour.
Dependencies are inferred from the claim text.