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US 4,524,089 AGranted
Three-step plasma treatment of copper foils to enhance their laminate adhesion
AssigneeOlin Corporation
InventorsReza Haque, Edward F. Smith, III
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Abstract
A three-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises sequentially exposing the substrate to a first plasma of oxygen gas, a second plasma of a hydrocarbon monomer gas and a third plasma of oxygen gas. The process has particular utility in forming polymeric films on one or more surfaces of copper or copper alloy foils to be used in printed circuit applications.
Claims13
A process for coating at least one surface of a substrate material with an adherent polymeric film, said process comprising:
- forming a first plasma of predominantly oxygen gas in the vicinity of said substrate material;
- exposing said substrate material to said first plasma for a first period of time;
- forming a plasma of a hydrocarbon monomer gas in the vicinity of said substrate material;
- exposing said substrate material to said hydrocarbon monomer gas plasma for a second period of time;
- forming a second plasma of predominantly oxygen gas in the vicinity of said substrate material;
- and
- exposing said substrate material to said second oxygen plasma for a third period of time.
4 more elements
Dependencies are inferred from the claim text.