TSMC Solid State Lighting Ltd.
Hsinchu, TW· latest recorded location
TSMC Solid State Lighting Ltd. is named on 116 US grants and 91 published applications in this corpus. Its most frequent classification is H10H (Inorganic light-emitting semiconductor devices having potential barriers).
- Granted patents
- 116
- Published applications
- 91
- Inventors
- 92
- Granted in 2026 so far
- 0
- Most recent grant
- 12 Apr 2016
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 6 |
| 2011 | 0 | 0 |
| 2012 | 7 | 5 |
| 2013 | 28 | 17 |
| 2014 | 43 | 41 |
| 2015 | 36 | 20 |
| 2016 | 2 | 0 |
By publication year.
Technology areas
Share of 207 documents
- H10HInorganic light-emitting semiconductor devices having potential barriers159
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by75
- F21VFunctional features or details of lighting devices or systems thereof49
- F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to39
- F21KNon-electric light sources using luminescence35
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered30
- H05BElectric heating17
- F21SNon-portable lighting devices16
- Y10TTechnical subjects covered by former us classification16
- H01SDevices using the process of light amplification by stimulated emission of radiation11
Recent patents
- Growing an improved P-GaN layer of an LED through pressure ramping12 Apr 2016US 9,312,432 B2
- Method and apparatus for fabricating phosphor-coated LED dies26 Jan 2016US 9,246,068 B2
- Coated diffuser cap for LED illumination device29 Dec 2015US 9,222,640 B2
- Methods of forming through silicon via openings29 Dec 2015US 9,224,636 B2
- Wafer level photonic device die structure and method of making the same29 Dec 2015US 9,224,932 B2
- Light-emitting devices with through-substrate via connections27 Aug 2015US 2015/0243848 A1
- Method and Structure for LED with Nano-Patterned Substrate9 Jul 2015US 2015/0194567 A1
- Light-emitting devices on textured substrates2 Jul 2015US 2015/0187992 A1
- Pre-cutting a back side of a silicon substrate for growing better iii-v group compound layer on a front side of the substrate18 Jun 2015US 2015/0171266 A1
- Doubled substrate multi-junction light emitting diode array structure11 Jun 2015US 2015/0162315 A1
Most cited
By later US patents
- Color temperature adjustment for LED lamps using switches37US 8,669,722 B22014
- Methods of fabricating light emitting diode packages28US 8,241,932 B12012
- LED lamp and method of making the same26US 8,414,160 B22013
- Light color and intensity adjustable LED17US 8,624,505 B22014
- Light emitting diode with a micro-structure lens having a ridged surface16US 8,969,894 B22015