Light-emitting devices with through-substrate via connections
AssigneeTSMC Solid State Lighting Ltd.
InventorHsin-Chieh Huang
Life of this patent
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Abstract
Multiple through-substrate vias (TSVs) are used to make electrical connections for an LED formed over a substrate. A first TSV extends through the substrate from a back surface of the substrate to the front surface of the substrate and includes a first TSV conductor that electrically connects to a first cladding layer of the LED. A second TSV extends through the substrate and an active layer of the LED from the back surface of the substrate to a second cladding layer or an ITO layer. The second TSV includes an isolation layer that electrically isolates a second TSV conductor from the first cladding layer and the active layer. Additionally dummy TSVs may be formed to conduct heat away from the LED optionally through a package substrate.
Claims9
A light-emitting device, comprising:
- a first semiconductor layer;
- a second semiconductor layer;
- a light-emitting layer sandwiched by the first semiconductor layer and the second semiconductor layer
- a first via penetrating the first semiconductor layer, the second semiconductor layer and the light-emitting layer, and electrically connected to the first semiconductor layer;
- a first isolation layer penetrating the first semiconductor layer, the second semiconductor layer and the light-emitting layer;
- and
- a second via electrically separated from the first semiconductor, the second semiconductor layer and the light-emitting layer by the first isolation layer.
A light-emitting device, comprising:
- a first semiconductor layer;
- a light-emitting layer formed on the first semiconductor layer;
- a second semiconductor layer formed on the light-emitting layer;
- a shorter via electrically separated from the first semiconductor layer, the second semiconductor layer and the light-emitting layer;
- and
- a longer via penetrating the first semiconductor layer, the second semiconductor layer and the light-emitting layer without directly connected to the first semiconductor layer and the light-emitting layer.
Dependencies are inferred from the claim text.