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US 9,246,068 B2Granted
Method and apparatus for fabricating phosphor-coated LED dies
AssigneeTSMC Solid State Lighting Ltd.
InventorsChi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
Life of this patent
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Abstract
The present disclosure involves a method. The method includes providing a substrate having a layer disposed thereon. A plurality of light-emitting devices is attached to the layer. A gel is applied over the substrate. The gel covers the plurality of light-emitting devices. The gel is shaped into a plurality of lenses. The lenses each cover a respective one of the light-emitting devices. The light-emitting devices are separated from one another. The substrate and the layer are removed.
Claims20
A method, comprising:
- providing a substrate having a layer disposed thereon;
- attaching a plurality of light-emitting devices to the layer;
- applying a gel over the substrate, the gel covering the plurality of light-emitting devices;
- shaping the gel into a plurality of lenses, wherein the lenses each cover a respective one of the light-emitting devices, wherein the lenses each include a first sub-layer and a second sub-layer, and wherein the first and second sub-layers have different characteristics;
- separating the light-emitting devices from one another;
- and
- removing the substrate and the layer.
4 more elements
A method, comprising:
- forming a layer on a substrate, the layer being an adhesive layer, or a photoresist layer, or a tape;
- attaching a plurality of light-emitting diodes (LEDs) to the substrate through the layer, the LEDs each being coated with a phosphor film;
- applying a gel over the substrate, the gel covering the plurality of LEDs;
- molding the gel into a plurality of lenses, wherein the lenses each house a respective one of the LEDs therein, and wherein the lenses each have a non-flat upper surface;
- singulating the plurality of LEDs;
- and
- removing the substrate and the layer.
4 more elements
A method, comprising:
- providing a substrate with a tape disposed thereon, wherein the tape contains an adhesive material;
- attaching a plurality of phosphor-coated light-emitting diode (LED) dies to the tape;
- applying a gel over the substrate, the gel covering the plurality of LED dies;
- molding the gel into a plurality of lenses, wherein the lenses each house a respective one of the LED dies underneath, and wherein the lenses each have a non-flat upper surface;
- singulating the plurality of LED dies;
- removing the tape and the substrate;
- and
- bonding the singulated LED dies to a printed circuit board.
5 more elements
Dependencies are inferred from the claim text.