Micro Engineering Inc.
Tokyo, JP· latest recorded location
MICRO ENGINEERING INC. is named on 2 US grants and 7 published applications in this corpus. Its most frequent classification is B24B (Machines, devices, or processes for grinding or polishing).
- Granted patents
- 2
- Published applications
- 7
- Inventors
- 6
- Granted in 2026 so far
- 0
- Most recent grant
- 4 Mar 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 0 | 2 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 1 | 0 |
| 2026 | 0 | 2 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 9 documents
Recent patents
- Polishing head, and polishing treatment device4 Mar 2025US 12,240,074 B2
- Substrate processing apparatus and substrate processing method19 Feb 2013US 8,375,963 B2
- Polishing apparatus and polishing table10 Sep 2026US 2026/0264195 A1
- Polishing head and polishing treatment device1 Jan 2026US 2026/0001192 A1
- Polishing head, and polishing treatment device14 Mar 2024US 2024/0082983 A1
- Adhesive residue removal apparatus and adhesive residue removal method6 Aug 2020US 2020/0249588 A1
- Polishing head and polishing processing device7 Jul 2016US 2016/0193712 A1
Most cited
By later US patents
None of its patents has been cited by a later US patent yet.